SUSS MicroTec Test Systems has received an order from a major Asian semiconductor memory manufacturer for its PA300PS with ProbeShield® Technology, the 300 mm wafer-level probe system for device characterization and reliability test. The decision follows a six-month, head-to-head comparison against the incumbent and major competition for wafer-level test solutions at the manufacturer’s facilities.

During this time, several benchmarking activities were undertaken, consisting mainly of advanced tests of semiconductor devices, such as flicker noise, I-V, C-V and S-parameter measurements, which are used to extract critical parameters in the device design and process control phases.

Major advantages of the system is its Automated Thermal Management™ (ATM) and ReAlign™ features that enable test procedures to run through the night and weekends at multiple temperature settings without operator intervention to re-align the probe tips to the test pads on the wafer each time temperature changes.

“The engineers at the manufacturer chose ProbeShield Technology due to the superior measurement results and significant time savings the advanced feature sets provide,” said Rob Carter, vice president of marketing and sales for SUSS MicroTec Test Systems. “They were particularly impressed with the unattended test capabilities that are provided with the unique Automated Thermal Management and ReAlign functions.”