The high cost of entry has made mmWave a barrier for many companies seeking growth opportunities, such as point-to-point radio, vehicle radar, metrology or other markets. Typically, a company considering whether to develop mmWave components or systems must establish an end-to-end capability, beginning with design expertise and extending to prototyping and manufacturing. Prototyping and manufacturing require an investment in equipment for die handling, pick-and-place, die attach and wire bonding, with a clean room to house assembly and test.
To help companies minimize this investment and get to market faster, HASCO offers system in package (SiP) components developed by gotMiC. The SiPs integrate GaAs MMIC die and other chip components into individual packages that enable companies to use conventional handling and storage systems, eliminating the investment in specialized and expensive assembly equipment. These SiPs are compatible with surface-mount pick-and-place and reflow processes, which simplifies the assembly of mmWave components on conventional PCBs. Integrating an RF front-end into a SiP reduces the number of RF transitions, which improves performance.
HASCO’s SiP components are available for all of gotMiC’s broadband, D-, E-, G-, V- and W-Band, including mixers, multipliers, amplifiers and transmit/receive front-ends. The SiPs have matched ports that are optimized to launch directly into waveguide. All of HASCO’s die products manufactured by gotMiC can be packaged in a SiP to replace traditional split-block packaging. These new mmWave SiPs, produced by gotMiC, expand HASCO’s line of mmWave MMIC die to PCB-level components, making mmWave accessible to new companies seeking growth opportunities.