PCB Design Guide to Via and Trace Currents and Temperatures
A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book explores how hot traces and vias will be and what board, circuit, design and environmental parameters are the most important. PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces are covered. The IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations are detailed.
Sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths and thermal gradients are presented. Voltage drops across traces and vias, the thermal effects going around right-angle corners and frequency effects are covered. Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure. Industrial CT scanning, and whether they might replace microsections for measuring trace parameters, are also considered.
“This book provides a good introduction to the complex field of reliability engineering as well as a useful reference for more experienced professionals. I found the examples given throughout the text to be practical and relevant to real-world problems that are often encountered in the field. The examples also provide support to understanding the material and applying the various analytical methods.”
- Francesco Palmeri,
Reliability Engineering and Asset Management Professional
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