In 2012, China consumed more than half of all the worldwide semiconductor market, growing by 8.7% in contrast to a 3% decline in the worldwide market to reach a new record of 52.5%. Continued strong global demand for China produced consumer electronics is the main reason for this continued strong growth.As China’s IC sales have tripled in the past ten years, its internally designed/produced IC global market share has increased from 4.5% in 2005 to about 12% of the worldwide industry. China will continue to be a strong consumer of IC’s produced elsewhere and will continue to develop its own internal design/manufacturing capabilities. With approximately 25% of the semiconductor market serving China’s communications, aerospace and defense markets, the need for RF/microwave ICs is expected to remain strong for both imported RFICs/MMICs and foundry services for Chinese fabless design enterprises.
Zhanchang Wang, senior RF researcher with Nokia Solutions Networks will moderate a round table discussion among global semiconductor foundries and integrated device manufacturers. Trends in process technology, geographical shifts and application-centric best practices for broadband, microwave, base station and mobile stations, broadcasting, space and security etc. will be compared. Various semiconductor technologies such as CMOS vs. GaAs for mobile and LDMOS vs. GaN for BTS will be considered from a design and manufacture capability perspective for emerging digital RF trends for wireless communications.
Moderator: Zhancang Wang received his Bachelor in automation and Master degree in RFIC from Beijing University of Technology in 2005 and 2008, respectively. He obtained both rich academic and industrial experience by working in Beijing Embedded System Key Lab, RDA Microelectronics, Datang Mobile Inc, Nokia Siemens Networks as RFIC engineer, senior RF researcher, research project manager and consultant for 3rd party research collaborators. He focused on advanced RF technology research and prototyping, including RF transceiver architecture, linearization technology, digital front end algorithm e.g. E-CFR, broadband and high efficiency PA technologies e.g. Doherty and variants, Envelope Tracking, Switch Mode PA, LINC with GaN, SiC and HV-GaAs. He was an IEEE member and committee member for several international conferences. He is an author and coauthor of 17 papers and 4 pending US patents on RF PA technology. He can be reached by email at: zhancang.wang@ieee.org
Panelist:
Freescale Semiconductor
William Yin is Asia Pacific General Manager and Executive Director for Freescale Semiconductor’s RF business. He joined Freescale in November 2012, and is responsible for leading the local design, product, project management and application teams as well as liaison with RF headquarters, other teams and the regional sales organization. Since obtaining his bachelor’s degree in 1989, Mr. Yin has nearly 25 years working experience in the areas of research and development, marketing and managing products for cellular and non-cellular RF power amplifiers, RF systems, power supplies, energy saving and other related areas. He and his teams have been involved in many industry firsts including the first Chinese feed-forward ultra linearity PA in 2001, the first worldwide Doherty+DPD high efficiency PA in 2005, the first worldwide multi-carrier GSM+DPD PA in 2007 and the first worldwide dual-band ultra broadband PA in 2010. Mr. Yin holds approximately 30 patents.
Peregrine Semiconductor
Dr. Jack Lu is the senior manager of IC design engineering for the High Performance Solutions (HPS) business unit at Peregrine Semiconductor. He leads a team of engineers in designing high performance SOI products and supporting the advanced research initiatives for Peregrine. Prior to joining Peregrine Semiconductor, Dr. Lu was an RFIC design engineer at Conexant Systems and NXP where he designed a number of key RF and analog circuits for both terrestrial, cable and satellite TV tuner products in both SiGe BiCMOS and 40nm CMOS technologies. His areas of expertise range from high speed digital and analog to RF and microwave IC design and product development. He has published a number of papers in IEEE journals and conference proceedings, including the Journal of Solid-State Circuits for his work on wideband local oscillators. He has been awarded one US Patent and filed a number of additional patent applications during his tenure at Peregrine. Dr. Lu received his BS and MS from the Radio Engineering Department of Southeast University in Nanjing China and his PhD in integrated circuit and systems from the Electrical Engineering Department of the University of California in Los Angeles, CA.
OMMIC
Marc Rocchi received his degree in electrical engineering and solid physics from the Ecole Supérieure d 'Electricité de paris in 1972. In 1976 he joined the Philips Research Lab in France to work on GaAs microwave and digital MMICs.In 1988 ; he moved to Philips Semiconductors in Holland to develop 1Mbit Si SRAMs. In 1991 he became the general manager of Philips Microwave Limeil which became OMMIC in 2000. He has been the president of OMMIC since 2010
TriQuint
Ting Xiong joined TriQuint in 1999 and has worked in various positions including engineering, marketing and sales. He is currently the Sales Director of APAC for TriQuint’s Infrastructure and Defense Products, with key focus on customized solutions for Point-to-Point radio, Optical and 4G Base Stations. Prior to TriQuint, Mr. Xiong worked in engineering at Mitsubishi and International Rectifier. Mr. Xiong has an MBA and MS in Physics from Portland State University, and a BS in Physics from Peking University, China