Handbook of Engineering Electromagnetics

Rajeev Bansal, Editor

Marcel Dekker Inc. • 720 pages; $129.95, £74.99
ISBN: 0-8247-5628-2

This handbook is intended as a desk reference for the broad area of engineering electromagnetics. It should serve as a bridge between standard textbooks in electromagnetic theory, which are comprehensive in terms of theoretical development and specialized references, which often offer detailed lists of formulas, tables and graphs, but do not provide the insight needed to appreciate the underlying physical concepts. Since the handbook is intended to be useful to engineers engaged in electromagnetic applications in a variety of professional settings, the coverage of topics is correspondingly broad in scope. In terms of “fundamental concepts,” the book includes coverage of Maxwell equations, static fields, electromagnetic induction, waves, transmission lines, waveguides, antennas and electromagnetic compatibility (Chapters 1 to 10). In terms of “electromagnetic technologies,” radar, wireless communication, satellite communication and optical communication are covered (Chapters 11 to 14). Chapter 15 provides an introduction to various numerical techniques being used for computer-aided solutions to complex electromagnetic problems. Given the ubiquitous nature of electromagnetic fields, it is important to consider their biological effects and safety standards (Chapter 16). Chapter 17 presents a concise survey of current and evolving biomedical applications, while Chapter 18 is a review of the techniques used for measuring the electromagnetic properties of biological materials. In terms of “frequency range,” this book spans the spectrum from static fields to light waves. Pertinent data in the form of tables and graphs are provided within the context of the subject matter. In addition, Appendices A and B are brief compilations of important electromagnetic constants and units, respectively. Finally, Appendix C is a convenient tutorial on vector analysis and coordinate systems.

To order this book, contact: CRC Press USA
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Post-processing Techniques for Integrated MEMS

Sherif Sedky

Artech House • 221 pages; $99, £56
ISBN: 1-58053-901-7

The increased demand to implement microelectromechanical systems (MEMS) in a variety of systems requires the monolithic integration of these devices together with the driving and control electronic circuitry on the same chip. This improves yield and reliability, especially for commercial devices in sensitive applications or in applications that require high density integration. The main purpose of this book is to investigate the possibility of developing high quality MEMS structural layers at temperatures compatible with the standard CMOS back end. First, the MEMS fabrication technologies are reviewed. This is followed by defining the maximum thermal budget that can be accommodated by prefabricated standard electronics. Then, the attractive features of the different materials suitable for MEMS are highlighted. The effect of deposition conditions and the type of substrate on the physical properties of the different materials is then discussed. Recently, silicon germanium has gained a lot of attention as a MEMS structural layer that can be processed at CMOS back end temperatures and preserve attractive properties for a variety of MEMS applications. This material is investigated in detail, as it seems to give promise for a simple modular integration process for MEMS on top of standard preprocessed electronics. In addition, low thermal budget techniques that can locally modify the physical properties of the MEMS materials without affecting the underlying layers are introduced. Finally, an overview of the recent developments in the field of MEMS monolithic integration with the driving electronics is given. The advantages and disadvantages of the different approaches implemented either commercially or in academia are highlighted. The milestones on the road to the formation of a generic modular monolithic integration of MEMS with the driving electronics are defined.

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