Find Events


Design and Analysis Solutions for Integrated RF Systems


Register For This Event


12/13/22 12:00 pm to 4:00 pm EDT

Event Description

Design and Analysis Solutions for Integrated RF Systems

Date: December 13, 2022

Time: 12:00 pm – 4:00 pm EDT

Don’t miss this one-day online Design and Analysis Solutions for Integrated RF Systems Forum featuring industry leaders covering key design topics for RF design engineers.

  • 12pmKEYNOTE: Cadence Solutions for RF Design Excellence 2022
    • Today’s commercial wireless systems are targeting communications and automotive applications that require higher performance and reduced size, cost, and weight for high-volume deployments. These system requirements are being met through the integration of heterogenous semiconductor technologies across the chip, package, and PCB, where interconnect technology is complex and continually evolving. As a result, design solutions are heavily reliant on reuseable design IP, integrated electromagnetic (EM) and multiphysics analysis, and implementation workflows. The latest RF-to-millimeter-wave (mmWave) design, analysis, and implementation solutions from Cadence deliver unconstrained capacity for analysis of large-scale and complex RF systems directly from within the RF design platform. This opening keynote sets the stage for the design solutions presented in this year’s RF Design Excellence 2022 event.
    • Presenter: David Vye, Senior Product Marketing Manager
  • 12:10pmIn-Design EM Analysis Addresses RF System Integration Challenges
    • The on-wafer RF power amplifier (PA) monolithic microwave IC (MMIC)d measurements agreed with simulations and yet the overall performance shifted out of specification when the device was integrated into the package module housing. Why? Chip/package integration is a common cause of delayed product deliveries and engineering cost overruns. In this presentation, Cadence design and analysis experts will discuss how effects related to MMIC/RFIC package integration can be identified and resolved prior to tapeout through in-design EM analysis and MMIC/RFIC co-simulation using distributed, multiprocessing EM analysis for large-scale RF structures with the Cadence Clarity™ 3D Solver and AWR Microwave Office® circuit design software.
    • Presenters: Gary Lytle, Product Marketing Director and Chris Bean, Senior Principal Applications Engineer
  • 1:00pmSystem Budgeting to System Realization - A 22nm FDSOI 5G mmWave Front-End Module
    • In this presentation a comprehensive top-down system design methodology is discussed and supported with a front-end module (FEM) design for 5G mobile applications targeting 24GHz-29GHz. While adopting package and PCB floor planning and thermal challenges early in the design, a link budget analysis of an FEM in a system simulator followed by an implementation in Global Foundries’ 22nm FDSOI process is reported with a focus on novel architectures to address system constraints. The FEM shows an excellent correlation between simulations and measurements and is further characterized post silicon by applying actual 5G signals in a real-time measurement mimicked simulation environment. A unified environment for co-designing and analyzing the IC and package system is also described.
    • Presenter: Dr. Ritabrata Bhattacharya, Senior Principal Engineer
  • 2:00pmCadence Further Streamlines MMIC, RFIC, and RF SiP Design Workflows
    • Demand for next generation wireless communication, aerospace and transportation systems is driving the need for high-performance, cost-sensitive silicon RFICs and III-V compound semiconductor MMICs, often integrated into advanced system-in-package (SiP) modules. The latest release of the AWR Design Environment platform enables product development teams to meet the challenging performance requirements of these wireless systems in less turnaround time through a comprehensive RF-to-mmWave design, EM analysis, and front-to-back workflows. This presentation will demonstrate key new features in AWR software that accelerate design entry and platform design sharing to enhance engineering productivity and ensure first-pass success.
    • Presenters: Nikolas Provatas, Product Marketing Group Director, Gus Dallman, Product Engineer and Shane Coffman, Product Engineer
  • 3:00pmIntegrated Thermal Analysis for RF MMIC and PCB Power Applications
    • Thermal analysis provides RF circuit designers with insight regarding operating temperatures that can degrade performance and threaten device reliability. With the recent integration of the Cadence Celsius™ Thermal Solver within the Cadence AWR Design Environment platform, RF designers now have access to electrothermal analysis for MMIC/RFIC, PCB, and module designs. This presentation- will highlight how the Celsius Thermal Solver uses design data such as layout geometries, material properties, and dissipated power simulation results from Microwave Office software to provide designers with thermal heat map visualization and operating temperature information.
    • Presenter: Dustin Hoekstra, Applications Engineer Architect

Please note:
By registering, you are agreeing to allow the data collected to be shared with Microwave Journal®, the presenter and the sponsor to contact you by email.