Pat Hindle, MWJ Editor
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Hindle
Pat Hindle is responsible for editorial content, article review and special industry reporting for Microwave Journal magazine and its web site in addition to social media and special digital projects. Prior to joining the Journal, Mr. Hindle held various technical and marketing positions throughout New England, including Marketing Communications Manager at M/A-COM (Tyco Electronics), Product/QA Manager at Alpha Industries (Skyworks), Program Manager at Raytheon and Project Manager/Quality Engineer at MIT. Mr. Hindle graduated from Northeastern University - Graduate School of Business Administration and holds a BS degree from Cornell University in Materials Science Engineering.

SA Says GaAs Evolving to Stave Off Si Challenge

December 1, 2009
Strategy Analytics reports that the GaAs industry is creating innovations designed to stave off the dual challenges of integration and low-cost silicon technologies. Newer BiFET and BiHEMT processes will enable GaAs device manufacturers to integrate HBT power amplifiers onto a single die with HEMT-based switches and other functions. Meanwhile, the use of optical lithography for production of smaller geometry processes will enable more cost-effective production of millimeter-wave ICs. But HBT and HEMT processes will continue to underpin the commercial market for GaAs devices which will be worth $4 - $5 billion by 2013, as stated in the latest Strategy Analytics study.

BiFET and BiHEMT technologies will enable the development of a future class of products, providing integrated solutions that retain the industry-leading performance offered by GaAs and necessary for next-generation wireless markets,” noted Steve Entwistle, VP of Strategy Analytics’ Strategic Technologies Practice.

GaAs is still erroneously perceived by many as an exotic, expensive technology,” said Asif Anwar, Director of the Strategy Analytics GaAs and Compound Semiconductor Technologies Service. “The reality is that GaAs technologies continue to meet the requirements from cost-sensitive markets, such as cellular handsets and is the most cost-effective technology for markets that require millimeter-wave performance.”

Mr. Anwar concluded, “The application of optical lithography for millimeter-wave IC production will significantly enhance the cost-effectiveness of GaAs compared to silicon technology-based offerings, while retaining the benefits of performance and faster time-to-market.”

How much progression do you think GaAs BiFET and BiHEMT processes are making to fend off Si improvements in integration and lower cost?
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