Industry News

QINETIQ AND L-3 SIGN MoU COVERING ISTAR AND ISR PROGRAMS

A Memorandum of Understanding (MoU) has been signed by L-3 Communications ' subsidiary Integrated Systems (L-3/IS), QinetiQ and QinetiQ Inc. , to collaborate on technology development around Intelligence, Surveillance, Target Acquisition and Reconnaissance (ISTAR) and ISR programs of mutual interest. The MoU aims to capitalize on the expertise in...
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AGILENT ANNOUNCES AGREEMENT WITH AURIGA

Agilent Technologies Inc. announced an agreement with Auriga Measurement Systems to jointly develop and market integrated device-modeling systems for the semiconductor industry. The companies plan to pair Agilent's IC-CAP parameter extraction and device-modeling software and instrumentation with Auriga's test instrumentation. The first system planned is a pulsed-bias/pulsed-RF solution for...
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COLLABORATION TO PROMOTE MOBILE WIMAX TECHNOLOGY

Motorola Inc. and Intel Corp. have announced plans to collaboratively foster greater industry momentum for WiMAX and to advance the use of mobile WiMAX technology, based on the proposed IEEE 802.16e standard, for both fixed and wireless broadband applications. As members of the WiMAX Forum the companies plan to...
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MIT AND NOKIA CENTER ON MOBILE RESEARCH

Nokia Research Center and the Massachusetts Institute of Technology Computer Science and Artificial Intelligence Laboratory (CSAIL) have announced a research collaboration to advance the state of the art in mobile computing and communications technologies. As a result a new research facility – the Nokia Research Center Cambridge – will...
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XPEDION AND JAZZ PARTNER TO PROVIDE QUALIFIED DESIGN ENVIRONMENT FOR NEXT GENERATION RFIC DESIGNS

Xpedion Design Systems Inc. , a provider of next generation RFIC simulation, and Jazz Semiconductor , an independent wafer foundry focused primarily on specialty CMOS process technologies, announced a partnership to deliver a qualified model and simulation environment for next generation RFIC design. "One of the biggest challenges in...
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GREEN LIGHT FOR PHILIPS LEAD-FREE PRODUCTS

Royal Philips Electronics has announced that the conversion to the Restriction of Hazardous Substances (RoHS) compliant/lead-free semiconductor products has been completed well ahead of European legislation mandating the manufacture of such electronic products by 1 July 2006 under European Commission Directive 2002/95/EC. In July 2001, Philips Semiconductors teamed up...
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