New 8 nm RF chip architecture provides up to 35 percent increase in power efficiency and 35 percent decrease in logic area compared to 14nm RF
June 9, 2021
Samsung Electronics introduced its newest RF technology based on an 8 nm process, designed to provide a one chip solution for 5G communications, supporting multi-channel and multi-antenna chip designs.
Qorvo® announced that it has acquired NextInput, a pioneer in the emerging field of force-sensing solutions for human-machine interface (HMI).The acquisition of NextInput enables Qorvo to accelerate the deployment of force-sensing solutions utilizing MEMS-based sensors.
The new FemtoClock2 family includes ultra-low jitter clock generators and jitter attenuators in a small 4 x 4 mm2 package, enabling cost-effective and simple clock tree implementation for next-generation, high speed interconnect designs.
MACOM Technology Solutions Inc.'s new high voltage capacitor semiconductor process is capable of achieving kilovolt (KV) operating levels in excess of 1,000 V, a level not previously achieved with silicon semiconductor technology.
Cree | Wolfspeed introduced four, multi-stage GaN on SiC MMIC devices, extending its range of RF solutions for X-Band, pulsed and CW phased array applications, including marine, weather surveillance and emerging unmanned aerial system radars.
With the modern mobile device revolution, semiconductor suppliers are challenged to increase capability, integration, and performance while reducing time to market. Test needs a new approach based on an open, flexible platform at significantly lower cost. NI is bridging this gap by building on the stability and capability of the PXI platform to deliver off-the-shelf modular technology to both the characterization and production engineer.