A room-temperature bonding technique for integrating wide bandgap materials such as GaN with thermally conducting materials such as diamond is intended to improve GaN device cooling to achieve higher output power, improved reliability and reduced manufacturing costs.
RFIC start-up MixComm has released its first production IC, an eight-channel RF front-end for 28 GHz, 5G phased array antenna systems. Sample quantities will be available during the second quarter of this year.
Taoglas®and MixComm announced a technology partnership to co-develop a mmWave 5G NR smart antenna covering 26.5 to 29.5 GHz. The mmWave antenna subsystem will support small cells, repeaters and customer-premises equipment designs.
Marvell and Analog Devices will collaborate to offer fully-integrated 5G digital front-end ASICs with tightly-coupled RF transceivers, developing next-generation radio solutions for a diverse set of functional splits and architectures.
Sivers IMA plans to begin sampling two beamformer ICs designed for the 24 and 28 GHz 5G bands. The RFICs integrate a pair of four-channel transmit and receive paths to support antenna arrays with horizontal and vertical polarization.
With the modern mobile device revolution, semiconductor suppliers are challenged to increase capability, integration, and performance while reducing time to market. Test needs a new approach based on an open, flexible platform at significantly lower cost. NI is bridging this gap by building on the stability and capability of the PXI platform to deliver off-the-shelf modular technology to both the characterization and production engineer.