Cree is selling its lighting business to Ideal Industries for $310 million. The deal will enable Cree to focus on Wolfspeed’s opportunities for SiC and GaN semiconductors and better meet Wall Street’s financial expectations.
MACOM Technology Solutions and STMicroelectronics (ST) announced ST will expand 150 mm RF GaN on Si production capacity for power amplifiers supporting the initial build of 5G base stations. MACOM will invest approximately $23 million in the expansion, which is scheduled to complete this year.
NXP Semiconductors and Movandihave formed a joint partnership to collaborate on millimeter wave solutions for 5G infrastructure. The partnership combines Movandi’s RF transceiver and systems architecture with NXP’s digital networking and signal processing portfolio.
United Monolithic Semiconductors (UMS) and TesatSpacecom GmbH & Co. KG (TESAT) have developed and manufactured hermetically packaged GaN microwave power transistor devices for the European Space Agency’s Biomass satellite.
Eta Wireless has introduced a power management IC to address the power challenges with 5G mobile phones. According to the company, this is the first power management solution for wideband millimeter wave devices, supporting the 800 MHz bandwidth defined in the 5G NR standard.
Analog Devices has released a pair of highly integrated up- and down-converters operating from 24 to 44 GHz — covering all 5G millimeter wave bands. With flat 1 GHz instantaneous bandwidth, the converters support all broadband services and ultra-wide bandwidth transceiver applications.
Qorvo® has shipped over 100 million 5G wireless infrastructure components since January 2018, according to the company. New products available to wireless infrastructure customers include a dual-channel switch LNA module, ultra-low noise figure LNA and Doherty power amplifier.
With the modern mobile device revolution, semiconductor suppliers are challenged to increase capability, integration, and performance while reducing time to market. Test needs a new approach based on an open, flexible platform at significantly lower cost. NI is bridging this gap by building on the stability and capability of the PXI platform to deliver off-the-shelf modular technology to both the characterization and production engineer.