Broadcom has negotiated two multi-year agreements to supply wireless components to Apple, complementing a similar agreement announced last June. Broadcom said the three agreements could generate revenue of some $15 billion over their three-and-a-half year lifetime.
UMS' 0.25 μm GaN and 0.15 μm GaAs PHEMT processes now support the electro-thermal simulation capability in Keysight’sPathwave ADS, enabling designers to simplify the MMIC design process while increasing confidence in their designs.
Sanan IC, a Chinese pure-play wafer foundry, has recognized Plextek RFI, a U.K. MMIC design firm, as an authorized resource for foundry customers seeking GaAs MMIC design services, particularly for mmWave MMICs.
During Broadcom's Q4 earnings call last week, CEO Hock Tan classified the wireless segment as a financial asset, implying the business could be sold. The Wall Street Journal reported this week that Broadcom is, indeed, seeking a buyer.
With the modern mobile device revolution, semiconductor suppliers are challenged to increase capability, integration, and performance while reducing time to market. Test needs a new approach based on an open, flexible platform at significantly lower cost. NI is bridging this gap by building on the stability and capability of the PXI platform to deliver off-the-shelf modular technology to both the characterization and production engineer.