In our latest industry chat, market analyst Earl Lum and I sat down to compare notes about the wireless industry and what caught our attention at #IMS2019. Listen to our conversation on this episode of the Microwave Journal podcast.
As detailed in a new report from Mobile Experts, the mmWave market for RF front-end components will grow to more than $1 billion by 2024, driven by smartphones, hotspots and fixed customer premises equipment.
GLOBALFOUNDRIES (GF) and Soitec announced the two companies have signed multiple long-term supply agreements for 300 mm silicon-on-insulator (SOI) wafers. The agreements assure GF will have sufficient high volume wafer supply to meet the demand for its RF SOI, fully-depleted SOI (FD-SOI) and silicon photonics process platforms.
Up to $15M revenue from Huawei was expected in fiscal Q4
June 11, 2019
Cree updated its financial guidance for the current quarter to reflect the impact of the Huawei export ban, as well as softness in the LED market. Cree said Huawei revenue could have been as high as $15 million this quarter.
pSemi announced the release of UltraCMOS® 13, the next-generation of its proprietary RFSOI process running on GlobalFoundries’ 300 mm wafer fab. UltraCMOS 13 was tailored to improve low noise amplifier (LNA) and power amplifier (PA) performance and enable improved performance from integrated front-end components.
ICONIC RF has announced two MMIC power amplifiers with high back-off efficiency, targeting 5G mmWave and satellite applications: a 5 W GaN on SiC covering 24 to 31 GHz and a 700 mW, 24 to 27 GHz GaAs Doherty amplifier.
Analog Devices, Inc. (ADI) introduced a new solution for mmWave 5G with the highest available level of integration to reduce design requirements and complexity in the next generation of cellular network infrastructure.
With the modern mobile device revolution, semiconductor suppliers are challenged to increase capability, integration, and performance while reducing time to market. Test needs a new approach based on an open, flexible platform at significantly lower cost. NI is bridging this gap by building on the stability and capability of the PXI platform to deliver off-the-shelf modular technology to both the characterization and production engineer.