RFIC Channel

RFIC, MMIC, semiconductor channel

ARTICLES

NXP Announces 5G mMIMO RF PA Modules

NXP Semiconductors has announced a portfolio of LDMOS RF power amplifier (PA) multi-chip modules (MCM) for 5G massive MIMO (mMIMO) base stations. The MCMs are available from NXP distributors and online partners.


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DOCUMENTS AND FILES

Bridging the Gap Between RF Front-End Module Characterization and Production Test With the Semiconductor Test System

With the modern mobile device revolution, semiconductor suppliers are challenged to increase capability, integration, and performance while reducing time to market. Test needs a new approach based on an open, flexible platform at significantly lower cost. NI is bridging this gap by building on the stability and capability of the PXI platform to deliver off-the-shelf modular technology to both the characterization and production engineer.
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