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      <title>Wireless Power Transfer: Waveform Efficiency, Interoperability and Technology Outlook</title>
      <description></description>
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      <guid>http://www.microwavejournal.com/articles/42965</guid>
      <pubDate>Wed, 13 Nov 2024 10:00:16 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/42965-wireless-power-transfer-waveform-efficiency-interoperability-and-technology-outlook</link>
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      <title>Enabling Simultaneous Multi-User Access to a Single Vector Network Analyzer</title>
      <description></description>
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      <guid>http://www.microwavejournal.com/articles/42963</guid>
      <pubDate>Wed, 13 Nov 2024 00:00:00 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/42963-enabling-simultaneous-multi-user-access-to-a-single-vector-network-analyzer</link>
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      <title>RF GaN-on-Si Technology Powers the Future of Wireless</title>
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      <guid>http://www.microwavejournal.com/articles/42962</guid>
      <pubDate>Wed, 13 Nov 2024 00:00:00 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/42962-rf-gan-on-si-technology-powers-the-future-of-wireless</link>
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      <title>Direct-to-Device: Satellite’s Breakout Second Act</title>
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      <guid>http://www.microwavejournal.com/articles/42961</guid>
      <pubDate>Wed, 13 Nov 2024 00:00:00 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/42961-direct-to-device-satellites-breakout-second-act</link>
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      <title>MEMS-Inside-CMOS Technology Makes RF MEMS a Reality for RF Front-Ends</title>
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      <guid>http://www.microwavejournal.com/articles/42960</guid>
      <pubDate>Wed, 13 Nov 2024 00:00:00 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/42960-mems-inside-cmos-technology-makes-rf-mems-a-reality-for-rf-front-ends</link>
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      <title>Time Travel: Circling the Square: P.H. Smith and His Chart</title>
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      <guid>http://www.microwavejournal.com/articles/42918</guid>
      <pubDate>Wed, 13 Nov 2024 00:00:00 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/42918-time-travel-circling-the-square-ph-smith-and-his-chart</link>
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      <title>Chinese Carmakers Make a Big Statement in Paris, Despite Trade Tariffs</title>
      <description>IDTechEx's new report, "Plug-in Hybrid and Battery Electric Cars 2025-2045: Technologies, Players, Regulations, Market Forecasts," reveals that just 1.4 percent more EVs (BEV and PHEV) were sold in H1 2024 than in H1 2023.</description>
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        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">IDTechEx's new report, "Plug-in Hybrid and Battery Electric Cars 2025-2045: Technologies, Players, Regulations, Market Forecasts," reveals that just 1.4 percent more EVs (BEV and PHEV) were sold in H1 2024 than in H1 2023. </span>
</p>]]>
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      <guid>http://www.microwavejournal.com/articles/42952</guid>
      <pubDate>Wed, 06 Nov 2024 08:52:15 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/42952-chinese-carmakers-make-a-big-statement-in-paris-despite-trade-tariffs</link>
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      <title>Online Spotlight: Troubleshooting for 5G Networks for Interference and PIM</title>
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      <guid>http://www.microwavejournal.com/articles/42778</guid>
      <pubDate>Tue, 05 Nov 2024 00:00:00 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/42778-troubleshooting-for-5g-networks-for-interference-and-pim</link>
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      <title>Emerging Trends and Key Markets in 2.5D and 3D Semiconductor Packaging Technologies</title>
      <description>IDTechEx's recent report, "Advanced Semiconductor Packaging 2025-2035: Forecasts, Technologies, Applications," delves deep into understanding the technical aspects of packaging technologies, examining industry challenges, the progress made by leading companies and providing market forecasts for the sector.</description>
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        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">IDTechEx's recent report, "Advanced Semiconductor Packaging 2025-2035: Forecasts, Technologies, Applications," delves deep into understanding the technical aspects of packaging technologies, examining industry challenges, the progress made by leading companies and providing market forecasts for the sector.</span>
</p>]]>
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      <guid>http://www.microwavejournal.com/articles/42938</guid>
      <pubDate>Mon, 04 Nov 2024 09:03:34 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/42938-emerging-trends-and-key-markets-in-25d-and-3d-semiconductor-packaging-technologies</link>
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      <title>China’s IP Strategy to Reclaim Control Over Its RF Front-end Industry</title>
      <description>China is making strategic moves to regain dominance in its domestic technology sectors. These efforts include reducing foreign influence in key areas such as power electronics, semiconductors and telecommunications, particularly within the RF front-end industry.</description>
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        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: start; widows: 2; word-spacing: 0px; display: inline !important; float: none;">China is making strategic moves to regain dominance in its domestic technology sectors. These efforts include reducing foreign influence in key areas such as power electronics, semiconductors and telecommunications, particularly within the RF front-end industry.</span>
</p>]]>
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      <guid>http://www.microwavejournal.com/articles/42882</guid>
      <pubDate>Thu, 31 Oct 2024 07:00:53 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/42882-chinas-ip-strategy-to-reclaim-control-over-its-rf-front-end-industry</link>
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      <title>AI Test for AI Devices</title>
      <description>In a market that is searching for growth in new areas while dealing with the challenges around a shift from a growth to a profitability mindset, it is a good time to pause and re-think how we’re designing and testing the next generation of wireless technologies, especially with the advent of AI.</description>
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        <![CDATA[<p>In a market that is searching for growth in new areas while dealing with the challenges around a shift from a growth to a profitability mindset, it is a good time to pause and re-think how we’re designing and testing the next generation of wireless technologies, especially with the advent of AI.</p>]]>
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      <guid>http://www.microwavejournal.com/articles/42863</guid>
      <pubDate>Mon, 21 Oct 2024 10:00:44 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/42863-ai-test-for-ai-devices</link>
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      <title>Online Spotlight: Toward 6G: Selecting the Antenna Type that Meets Future Design Challenges</title>
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      <guid>http://www.microwavejournal.com/articles/42866</guid>
      <pubDate>Wed, 16 Oct 2024 11:00:00 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/42866-toward-6g-selecting-the-antenna-type-that-meets-future-design-challenges</link>
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      <title>Extracting Diode Parameters Using Optimization in Excel Part 1: DC Parameters from I-V Measurements</title>
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      <guid>http://www.microwavejournal.com/articles/42825</guid>
      <pubDate>Mon, 14 Oct 2024 00:00:00 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/42825-extracting-diode-parameters-using-optimization-in-excel-part-1-dc-parameters-from-i-v-measurements</link>
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      <title>PCB Design for Multichannel Beamformer RF Integrated Circuits</title>
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      <guid>http://www.microwavejournal.com/articles/42824</guid>
      <pubDate>Mon, 14 Oct 2024 00:00:00 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/42824-pcb-design-for-multichannel-beamformer-rf-integrated-circuits</link>
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      <title>Unlocking the Future of Telecoms</title>
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      <guid>http://www.microwavejournal.com/articles/42823</guid>
      <pubDate>Mon, 14 Oct 2024 00:00:00 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/42823-unlocking-the-future-of-telecoms</link>
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      <title>The Critical Role of Passive Components in Electronic Integration</title>
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      <guid>http://www.microwavejournal.com/articles/42822</guid>
      <pubDate>Mon, 14 Oct 2024 00:00:00 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/42822-the-critical-role-of-passive-components-in-electronic-integration</link>
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