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    <title>Software EDA Channel - Press Releases, Events, and Announcements for the EDA Sector</title>
    <description>
      <![CDATA[Software/EDA related topics]]>
    </description>
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    <language>en-us</language>
    <item>
      <title>Signal Hound Adds Pulse Analysis Tool Kit to Spike</title>
      <description>
        <![CDATA[<p>Signal Hound announced a new licensed Spike™ software measurement tool kit that adds comprehensive pulse and radar signal analysis for both commercial and defense applications.</p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/45863</guid>
      <pubDate>Wed, 03 Jun 2026 16:07:05 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/45863-signal-hound-adds-pulse-analysis-tool-kit-to-spike</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/News/signal-hound-6-3-26.webp?t=1780517248" type="image/jpeg" medium="image" fileSize="139881">
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      <title>Emerson Unveils AI-Ready Test Automation Platform at Annual NI Connect Conference</title>
      <description>
        <![CDATA[<p>Emerson announced the expansion of NI Nigel™ AI across its test software portfolio, introducing new prompt-based code generation in the NI LabVIEW+ Suite and further evolving the NI platform into an integrated, AI-ready test automation platform. </p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/45746</guid>
      <pubDate>Wed, 13 May 2026 11:27:23 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/45746-emerson-unveils-ai-ready-test-automation-platform-at-annual-ni-connect-conference</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/News/emerson-5-13-26.webp?t=1778686406" type="image/jpeg" medium="image" fileSize="250573">
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    <item>
      <title>COMSOL Conference Returns in 2026 in Boston, the UK, India, and Japan</title>
      <description>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">COMSOL announced the locations of its worldwide COMSOL Conference 2026 tour, which will kick off in Cambridge, the U.K., on September 23–25.</span>
</p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/45482</guid>
      <pubDate>Thu, 12 Mar 2026 10:46:48 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/45482-comsol-conference-returns-in-2026-in-boston-the-uk-india-and-japan</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/News/comsol-conf-3-12-26.webp?t=1773326974" type="image/jpeg" medium="image" fileSize="198099">
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    </item>
    <item>
      <title>Siemens Accelerates Integrated Circuit Design and Verification with Agentic AI in Questa One</title>
      <description>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">Siemens announced the Questa One Agentic Toolkit, which brings domain-scoped agentic AI workflows to its Questa™ One smart verification software portfolio.</span></p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/45426</guid>
      <pubDate>Fri, 27 Feb 2026 09:58:18 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/45426-siemens-accelerates-integrated-circuit-design-and-verification-with-agentic-ai-in-questa-one</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/News/Siemens-2-27-26.webp?t=1772205229" type="image/jpeg" medium="image" fileSize="77283">
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    </item>
    <item>
      <title>Emerson Reaches Milestone with Enhanced AI for Flagship Test and Measurement Software Platform</title>
      <description>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">Emerson announced an updated version of NI Nigel™ AI, the industry’s first test-optimized AI technology, as well as new capabilities across its NI LabVIEW+ Suite.</span>
</p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/45282</guid>
      <pubDate>Tue, 03 Feb 2026 08:00:27 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/45282-emerson-reaches-milestone-with-enhanced-ai-for-flagship-test-and-measurement-software-platform</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/Emerson-2-3-26.webp?t=1769521552" type="image/jpeg" medium="image" fileSize="84624">
        <media:title type="plain">Emerson-2-3-26.jpg</media:title>
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    </item>
    <item>
      <title>Keysight Unveils Machine Learning Toolkit to Accelerate Device Modeling and PDK Development</title>
      <description>
        <![CDATA[<p>Keysight Technologies, Inc. announced the release of the new Machine Learning Toolkit in the latest Keysight Device Modeling Software Suite.</p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/45249</guid>
      <pubDate>Thu, 15 Jan 2026 08:24:25 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/45249-keysight-unveils-machine-learning-toolkit-to-accelerate-device-modeling-and-pdk-development</link>
    </item>
    <item>
      <title>Keysight Accelerates Electronic Design Productivity with Secure AI-Powered Assistants</title>
      <description>
        <![CDATA[<p>Keysight Technologies, Inc. announced AI-powered Chat and Copilot assistants for its Advanced Design System (ADS), delivering breakthrough natural language capabilities that accelerate design workflows while maintaining enterprise-grade security.</p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/45157</guid>
      <pubDate>Tue, 16 Dec 2025 15:44:23 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/45157-keysight-accelerates-electronic-design-productivity-with-secure-ai-powered-assistants</link>
    </item>
    <item>
      <title>COMSOL Speeds Simulation with Expanded NVIDIA GPU Support for COMSOL Multiphysics® Version 6.4</title>
      <description>
        <![CDATA[<p>COMSOL announced the release of COMSOL Multiphysics<sup>®</sup> version 6.4, which introduces new features, major performance improvements and expanded capabilities for multiphysics modeling and simulation app development. </p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/45081</guid>
      <pubDate>Wed, 26 Nov 2025 08:24:24 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/45081-comsol-speeds-simulation-with-expanded-nvidia-gpu-support-for-comsol-multiphysics-version-64</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/comsol-11-26-25.webp?t=1764164316" type="image/jpeg" medium="image" fileSize="122511">
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    <item>
      <title>Major News in COMSOL Multiphysics® Version 6.4</title>
      <description>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: 0.15px; orphans: 2; text-align: start; widows: 2; word-spacing: 0px; display: inline !important; float: none;">COMSOL&nbsp;Multiphysics</span><sup style="box-sizing: border-box; font-style: normal; font-weight: 400; letter-spacing: 0.15px; orphans: 2; text-align: start; widows: 2; word-spacing: 0px;">®</sup><span style=" font-style: normal; font-weight: 400; letter-spacing: 0.15px; orphans: 2; text-align: start; widows: 2; word-spacing: 0px; display: inline !important; float: none;">&nbsp;version 6.4 introduces new modeling and productivity features, major performance improvements and expanded multiphysics capabilities.</span>
</p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/45051</guid>
      <pubDate>Tue, 18 Nov 2025 13:50:25 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/45051-major-news-in-comsol-multiphysics-version-64</link>
    </item>
    <item>
      <title>Keysight Completes Acquisition of Synopsys’ Optical Solutions Group and Ansys’ PowerArtist</title>
      <description>
        <![CDATA[<p>Keysight Technologies, Inc. &nbsp;announced the completion of its acquisition of the Optical Solutions Group from Synopsys, Inc. and PowerArtist from Ansys, Inc.&nbsp;</p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/44903</guid>
      <pubDate>Mon, 20 Oct 2025 13:28:09 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/44903-keysight-completes-acquisition-of-synopsys-optical-solutions-group-and-ansys-powerartist</link>
    </item>
    <item>
      <title>Reimagining Possibilities for Next-Gen Simulation in RF EDA</title>
      <description>
        <![CDATA[]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/44438</guid>
      <pubDate>Fri, 11 Jul 2025 00:00:00 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/44438-reimagining-possibilities-for-next-gen-simulation-in-rf-eda</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/New--44438.webp?t=1752160972" type="image/png" medium="image" fileSize="226588">
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    </item>
    <item>
      <title>Remcom Releases Next-Generation Wireless InSite</title>
      <description>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">Remcom announced a new version of Wireless InSite® 3D Wireless Prediction Software with advanced capabilities including time-based mobility, lunar propagation modeling and wideband ray-tracing with S-parameter outputs.</span></p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/43948</guid>
      <pubDate>Wed, 14 May 2025 10:05:17 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/43948-remcom-releases-next-generation-wireless-insite</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/Remcom-5-14-25.webp?t=1748979744" type="image/jpeg" medium="image" fileSize="199312">
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    </item>
    <item>
      <title>COMSOL Conference 2025 to Kick Off in Boston</title>
      <description>
        <![CDATA[<p>COMSOL announced that the first stop of its worldwide COMSOL Conference 2025 tour will be held in Boston, Mass., on October 8–10.&nbsp;</p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/43831</guid>
      <pubDate>Tue, 29 Apr 2025 16:15:40 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/43831-comsol-conference-2025-to-kick-off-in-boston</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/Comsol-4-29-25.webp?t=1745958139" type="image/jpeg" medium="image" fileSize="176985">
        <media:title type="plain">Comsol-4-29-25.jpg</media:title>
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    </item>
    <item>
      <title>New Stable Release of PicoScope 7.1.50 Brings Advanced Tools and Enhanced Performance</title>
      <description>
        <![CDATA[<p>Pico Technology Ltd. has released PicoScope 7.1.50 Test & Measurement — the latest stable version of the software.</p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/43807</guid>
      <pubDate>Tue, 22 Apr 2025 08:38:38 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/43807-new-stable-release-of-picoscope-7150-brings-advanced-tools-and-enhanced-performance</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/Pico-4-22-25.webp?t=1745325896" type="image/jpeg" medium="image" fileSize="191593">
        <media:title type="plain">Pico-4-22-25.jpg</media:title>
      </media:content>
    </item>
    <item>
      <title>Maury Microwave Introduces InsightPro, A Next-generation Measurement and Modeling Software Platform</title>
      <description>
        <![CDATA[<p>Maury Microwave announced the official launch of InsightPro<sup>TM&nbsp;</sup>— their next-generation unified software suite designed to accelerate measurement and modeling workflows across R&D, design verification/validation and small-scale production.&nbsp;</p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/43739</guid>
      <pubDate>Wed, 16 Apr 2025 08:00:03 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/43739-maury-microwave-introduces-insightpro-a-next-generation-measurement-and-modeling-software-platform</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/Maury-4-16-25.webp?t=1744804855" type="image/jpeg" medium="image" fileSize="105472">
        <media:title type="plain">Maury-4-16-25.jpg</media:title>
      </media:content>
    </item>
    <item>
      <title>Siemens Acquires Altair to Create Most Complete AI-Powered Portfolio of Industrial Software</title>
      <description>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">Siemens announced that it has completed the acquisition of Altair Engineering Inc.</span></p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/43593</guid>
      <pubDate>Wed, 26 Mar 2025 09:21:02 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/43593-siemens-acquires-altair-to-create-most-complete-ai-powered-portfolio-of-industrial-software</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/Siemens-3-26-25.webp?t=1742995712" type="image/jpeg" medium="image" fileSize="129251">
        <media:title type="plain">Siemens-3-26-25.jpg</media:title>
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    <item>
      <title>Remcom Announces Huygens Antennas to Integrate On-body Near-field and Far-field Electromagnetic Modeling in Dynamic Scenarios</title>
      <description>
        <![CDATA[<p>Remcom announced the integration of XFdtd® 3D Electromagnetic Simulation Software with Wireless InSite® 3D Wireless Propagation Software through a new Huygens surface capability. </p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/43137</guid>
      <pubDate>Tue, 10 Dec 2024 09:34:58 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/43137-remcom-announces-huygens-antennas-to-integrate-on-body-near-field-and-far-field-electromagnetic-modeling-in-dynamic-scenarios</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/remcom-12-10-24.webp?t=1733841842" type="image/jpeg" medium="image" fileSize="86016">
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    <item>
      <title>COMSOL Releases Version 6.3 of COMSOL Multiphysics®</title>
      <description>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">COMSOL announced the release of COMSOL Multiphysics® version 6.3, which delivers new features and capability updates for efficient physics modeling and simulation app development.</span>
</p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/43061</guid>
      <pubDate>Tue, 19 Nov 2024 15:35:10 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/43061-comsol-releases-version-63-of-comsol-multiphysics</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/Comsol-11-19-24.webp?t=1732048921" type="image/jpeg" medium="image" fileSize="80590">
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      </media:content>
    </item>
    <item>
      <title>Siemens to Acquire Altair for $10.6 B</title>
      <description>
        <![CDATA[<p>Siemens is to buy U.S. engineering software firm Altair Engineering for $10.6 billion, strengthening its position in the growing market for industrial software.</p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/42935</guid>
      <pubDate>Fri, 01 Nov 2024 13:34:19 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/42935-siemens-to-acquire-altair-for-106-b</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/siemens-11-1-24.webp?t=1730483427" type="image/jpeg" medium="image" fileSize="46411">
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    </item>
    <item>
      <title>Comsol Conference Boston 2024 - Preview of Version 6.3</title>
      <description>
        <![CDATA[]]>
      </description>
      <guid>http://www.microwavejournal.com/blogs/9/post/42816</guid>
      <pubDate>Tue, 08 Oct 2024 17:12:33 -0400</pubDate>
      <link>https://www.microwavejournal.com/blogs/9-pat-hindle-mwj-editor/post/42816-comsol-conference-boston-2024-preview-of-version-63</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/2024/10/08/Keynote.webp?t=1728423436" type="image/jpeg" medium="image" fileSize="114109">
        <media:title type="plain">Comsol 6.3</media:title>
      </media:content>
    </item>
    <item>
      <title>Remcom to Provide NASA with Lunar Wireless Channel Simulation for LunaNet</title>
      <description>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">Remcom has been awarded a Small Business Innovative Research (SBIR) Phase II contract to provide NASA with mission-critical capabilities for wireless channel simulation and coverage analysis for lunar environments. </span>
</p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/42528</guid>
      <pubDate>Thu, 22 Aug 2024 10:04:58 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/42528-remcom-to-provide-nasa-with-lunar-wireless-channel-simulation-for-lunanet</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/Remcom-8-22-24.webp?t=1724336365" type="image/jpeg" medium="image" fileSize="122162">
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      <title>Ansys 2024 R2 Delivers Multiphysics Innovation Across Industries and Engineering Domains </title>
      <description>
        <![CDATA[<p>Ansys 2024 R2 redefines the boundaries of product design by enabling customers to move beyond the limits of single-physics simulation to gain multidimensional insight into the performance of today’s complex products.</p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/42373</guid>
      <pubDate>Tue, 23 Jul 2024 14:17:26 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/42373-ansys-2024-r2-delivers-multiphysics-innovation-across-industries-and-engineering-domains</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/ansys-7-23-24.webp?t=1721759212" type="image/jpeg" medium="image" fileSize="87853">
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      </media:content>
    </item>
    <item>
      <title>RF Design Migration Flow </title>
      <description>
        <![CDATA[<p>Keysight, Synopsys and Ansys introduce a new integrated RF design migration flow from TSMC's N16 process to its N6RF+ technology.</p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/41833</guid>
      <pubDate>Wed, 24 Apr 2024 09:30:59 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/41833-keysight-synopsys-and-ansys-deliver-rf-design-migration-flow-to-tsmcs-n6rf-process-node</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/keysight-4-24-24.webp?t=1713974199" type="image/jpeg" medium="image" fileSize="125586">
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      <title>Keysight Introduces Next-Generation RF Circuit Simulator for RFIC Chip Designers</title>
      <description>
        <![CDATA[<p>Keysight Technologies, Inc. introduces RFPro Circuit, a next-generation RF simulation tool targeting the complex, multi-physics requirements of today's RFIC designers. </p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/41809</guid>
      <pubDate>Thu, 18 Apr 2024 11:58:34 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/41809-keysight-introduces-next-generation-rf-circuit-simulator-for-rfic-chip-designers</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/2024/04/24/keysight-4-18-24wjt.webp?t=1714004182" type="image/jpeg" medium="image" fileSize="43878">
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      <title>COMSOL Conference 2024 to Kick Off in Boston</title>
      <description>
        <![CDATA[<p>The first stop of the worldwide COMSOL Conference 2024 tour is slated to be held in Boston, Mass., on October 2–4. </p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/41776</guid>
      <pubDate>Wed, 10 Apr 2024 10:58:54 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/41776-comsol-conference-2024-to-kick-off-in-boston</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/comsol-boston2024.webp?t=1712762599" type="image/jpeg" medium="image" fileSize="264113">
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      <title>Ansys and NVIDIA Pioneer Next Era of Computer-Aided Engineering  </title>
      <description>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">Ansys announced a collaboration with NVIDIA to develop next-generation simulation solutions powered by accelerated computing and generative AI.</span>
</p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/41708</guid>
      <pubDate>Tue, 26 Mar 2024 09:48:44 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/41708-ansys-and-nvidia-pioneer-next-era-of-computer-aided-engineering</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/ansys-3-26-24.webp?t=1711461356" type="image/jpeg" medium="image" fileSize="186391">
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      <title>Keysight Introduces QuantumPro Delivering First Integrated EDA Workflow for Qubit Design</title>
      <description>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">Keysight Technologies, Inc. introduces QuantumPro, the EDA industry’s first integrated EM design and simulation tool and workflow tailored for seamless creation of quantum computers based on superconducting qubits.</span></p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/41548</guid>
      <pubDate>Wed, 28 Feb 2024 08:33:18 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/41548-keysight-introduces-quantumpro-delivering-first-integrated-eda-workflow-for-qubit-design</link>
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    </item>
    <item>
      <title>EMA Design Automation to Spin-Off IP &amp; Services Group</title>
      <description>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">EMA Design Automation® is spinning off their IP, content and services group as a new company named Accelerated Designs, LLC with a focus on CAD agnostic solutions. </span>
</p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/41181</guid>
      <pubDate>Tue, 05 Dec 2023 08:05:41 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/41181-ema-design-automation-to-spin-off-ip-and-services-group</link>
    </item>
    <item>
      <title>COMSOL Releases Version 6.2 of COMSOL Multiphysics®</title>
      <description>
        <![CDATA[<p>COMSOL announced the release of COMSOL Multiphysics® version 6.2, adding data-driven surrogate model functionality for efficient standalone simulation apps and multiphysics-based digital twins.</p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/41075</guid>
      <pubDate>Tue, 07 Nov 2023 13:55:08 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/41075-comsol-releases-version-62-of-comsol-multiphysics</link>
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    </item>
    <item>
      <title>Optenni Unveils New Schematic Entry Environment </title>
      <description>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">The new Optenni Lab version 6.0 offers a unique RF circuit design environment with fully integrated circuit synthesis capabilities and optimization of antenna and radiation characteristics.</span>
</p>]]>
      </description>
      <guid>http://www.microwavejournal.com/articles/40994</guid>
      <pubDate>Mon, 23 Oct 2023 08:16:28 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/40994-optenni-unveils-new-schematic-entry-environment</link>
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