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    <title>Software EDA Channel - Press Releases, Events, and Announcements for the EDA Sector</title>
    <description>Software/EDA related topics</description>
    <link>https://www.microwavejournal.com/rss</link>
    <language>en-us</language>
    <item>
      <title>Keysight Addresses Cross-Domain Physics Issues That Leave Electronic Designs Vulnerable to Late-Stage Failure</title>
      <description>Keysight Technologies announced Keysight Multiphysics, a design and verification solution that addresses the physics interactions driving failure in modern electronic designs. The structural analysis application covering drop, shock and vibration enables engineering teams to identify and fix problems earlier, before a prototype is built.</description>
      <content:encoded>
        <![CDATA[<p>Keysight Technologies announced Keysight Multiphysics, a design and verification solution that addresses the physics interactions driving failure in modern electronic designs. The structural analysis application covering drop, shock and vibration enables engineering teams to identify and fix problems earlier, before a prototype is built.</p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/46017</guid>
      <pubDate>Tue, 21 Jul 2026 16:12:33 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/46017-keysight-addresses-cross-domain-physics-issues-that-leave-electronic-designs-vulnerable-to-late-stage-failure</link>
    </item>
    <item>
      <title>Siemens to Acquire Precision Innovations to Expand AI-Powered System-on-a-Chip Design Exploration and Optimization</title>
      <description>Siemens announced that it has signed an agreement to acquire Precision Innovations Inc., a privately held electronic design automation software company, expanding Siemens’ EDA portfolio with AI-powered chip planning capabilities that help semiconductor teams optimize power, performance and area earlier in the system-on-chip design process.</description>
      <content:encoded>
        <![CDATA[<p>Siemens announced that it has signed an agreement to acquire Precision Innovations Inc., a privately held electronic design automation software company, expanding Siemens’ EDA portfolio with AI-powered chip planning capabilities that help semiconductor teams optimize power, performance and area earlier in the system-on-chip design process.</p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/46014</guid>
      <pubDate>Tue, 21 Jul 2026 12:36:47 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/46014-siemens-to-acquire-precision-innovations-to-expand-ai-powered-system-on-a-chip-design-exploration-and-optimization</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/article-images/Siemens-acquires-Precision.webp?t=1784652982" type="image/png" medium="image" fileSize="63982">
        <media:title type="plain">Siemens acquires Precision.png</media:title>
      </media:content>
    </item>
    <item>
      <title>Keysight and WIN Semiconductors Collaborate to Cut Design Risk for High Frequency RF Components</title>
      <description>Keysight Technologies, Inc. and WIN Semiconductors Corp. today announced a joint MMIC design workflow that enables GaN MMIC design houses to achieve first pass tapeout success.</description>
      <content:encoded>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">Keysight Technologies, Inc. and WIN Semiconductors Corp. today announced a joint MMIC design workflow that enables GaN MMIC design houses to achieve first pass tapeout success.</span>
</p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/45981</guid>
      <pubDate>Tue, 30 Jun 2026 12:12:24 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/45981-keysight-and-win-semiconductors-collaborate-to-cut-design-risk-for-high-frequency-rf-components</link>
    </item>
    <item>
      <title>Keysight Expands Photonic Design Automation Portfolio with System-Level Simulation</title>
      <description>Keysight Technologies, Inc. (NYSE: KEYS) announced that it completed the acquisition of VPIphotonics on June 9, 2026, adding system-level simulation to its photonic design automation portfolio and enabling optical and electrical engineers to advance designs from component to complete link within a single environment.</description>
      <content:encoded>
        <![CDATA[<p>Keysight Technologies, Inc. (NYSE: KEYS) announced that it completed the acquisition of VPIphotonics on June 9, 2026, adding system-level simulation to its photonic design automation portfolio and enabling optical and electrical engineers to advance designs from component to complete link within a single environment.</p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/45927</guid>
      <pubDate>Tue, 16 Jun 2026 14:47:25 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/45927-keysight-expands-photonic-design-automation-portfolio-with-system-level-simulation</link>
    </item>
    <item>
      <title>Signal Hound Adds Pulse Analysis Tool Kit to Spike</title>
      <description>Signal Hound announced a new licensed Spike™ software measurement tool kit that adds comprehensive pulse and radar signal analysis for both commercial and defense applications.</description>
      <content:encoded>
        <![CDATA[<p>Signal Hound announced a new licensed Spike™ software measurement tool kit that adds comprehensive pulse and radar signal analysis for both commercial and defense applications.</p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/45863</guid>
      <pubDate>Wed, 03 Jun 2026 16:07:05 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/45863-signal-hound-adds-pulse-analysis-tool-kit-to-spike</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/News/signal-hound-6-3-26.webp?t=1780517248" type="image/jpeg" medium="image" fileSize="139881">
        <media:title type="plain">signal hound-6-3-26.jpg</media:title>
      </media:content>
    </item>
    <item>
      <title>Emerson Unveils AI-Ready Test Automation Platform at Annual NI Connect Conference</title>
      <description>Emerson announced the expansion of NI Nigel™ AI across its test software portfolio, introducing new prompt-based code generation in the NI LabVIEW+ Suite and further evolving the NI platform into an integrated, AI-ready test automation platform.</description>
      <content:encoded>
        <![CDATA[<p>Emerson announced the expansion of NI Nigel™ AI across its test software portfolio, introducing new prompt-based code generation in the NI LabVIEW+ Suite and further evolving the NI platform into an integrated, AI-ready test automation platform. </p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/45746</guid>
      <pubDate>Wed, 13 May 2026 11:27:23 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/45746-emerson-unveils-ai-ready-test-automation-platform-at-annual-ni-connect-conference</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/News/emerson-5-13-26.webp?t=1778686406" type="image/jpeg" medium="image" fileSize="250573">
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      </media:content>
    </item>
    <item>
      <title>COMSOL Conference Returns in 2026 in Boston, the UK, India, and Japan</title>
      <description>COMSOL announced the locations of its worldwide COMSOL Conference 2026 tour, which will kick off in Cambridge, the U.K., on September 23–25.</description>
      <content:encoded>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">COMSOL announced the locations of its worldwide COMSOL Conference 2026 tour, which will kick off in Cambridge, the U.K., on September 23–25.</span>
</p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/45482</guid>
      <pubDate>Thu, 12 Mar 2026 10:46:48 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/45482-comsol-conference-returns-in-2026-in-boston-the-uk-india-and-japan</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/News/comsol-conf-3-12-26.webp?t=1773326974" type="image/jpeg" medium="image" fileSize="198099">
        <media:title type="plain">comsol-conf-3-12-26.jpg</media:title>
      </media:content>
    </item>
    <item>
      <title>Siemens Accelerates Integrated Circuit Design and Verification with Agentic AI in Questa One</title>
      <description>Siemens announced the Questa One Agentic Toolkit, which brings domain-scoped agentic AI workflows to its Questa™ One smart verification software portfolio.</description>
      <content:encoded>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">Siemens announced the Questa One Agentic Toolkit, which brings domain-scoped agentic AI workflows to its Questa™ One smart verification software portfolio.</span></p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/45426</guid>
      <pubDate>Fri, 27 Feb 2026 09:58:18 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/45426-siemens-accelerates-integrated-circuit-design-and-verification-with-agentic-ai-in-questa-one</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/News/Siemens-2-27-26.webp?t=1772205229" type="image/jpeg" medium="image" fileSize="77283">
        <media:title type="plain">Siemens-2-27-26.jpg</media:title>
      </media:content>
    </item>
    <item>
      <title>Emerson Reaches Milestone with Enhanced AI for Flagship Test and Measurement Software Platform</title>
      <description>Emerson announced an updated version of NI Nigel™ AI, the industry’s first test-optimized AI technology, as well as new capabilities across its NI LabVIEW+ Suite.</description>
      <content:encoded>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">Emerson announced an updated version of NI Nigel™ AI, the industry’s first test-optimized AI technology, as well as new capabilities across its NI LabVIEW+ Suite.</span>
</p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/45282</guid>
      <pubDate>Tue, 03 Feb 2026 08:00:27 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/45282-emerson-reaches-milestone-with-enhanced-ai-for-flagship-test-and-measurement-software-platform</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/Emerson-2-3-26.webp?t=1769521552" type="image/jpeg" medium="image" fileSize="84624">
        <media:title type="plain">Emerson-2-3-26.jpg</media:title>
      </media:content>
    </item>
    <item>
      <title>Keysight Unveils Machine Learning Toolkit to Accelerate Device Modeling and PDK Development</title>
      <description>Keysight Technologies, Inc. announced the release of the new Machine Learning Toolkit in the latest Keysight Device Modeling Software Suite.</description>
      <content:encoded>
        <![CDATA[<p>Keysight Technologies, Inc. announced the release of the new Machine Learning Toolkit in the latest Keysight Device Modeling Software Suite.</p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/45249</guid>
      <pubDate>Thu, 15 Jan 2026 08:24:25 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/45249-keysight-unveils-machine-learning-toolkit-to-accelerate-device-modeling-and-pdk-development</link>
    </item>
    <item>
      <title>Keysight Accelerates Electronic Design Productivity with Secure AI-Powered Assistants</title>
      <description>Keysight Technologies, Inc. announced AI-powered Chat and Copilot assistants for its Advanced Design System (ADS), delivering breakthrough natural language capabilities that accelerate design workflows while maintaining enterprise-grade security.</description>
      <content:encoded>
        <![CDATA[<p>Keysight Technologies, Inc. announced AI-powered Chat and Copilot assistants for its Advanced Design System (ADS), delivering breakthrough natural language capabilities that accelerate design workflows while maintaining enterprise-grade security.</p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/45157</guid>
      <pubDate>Tue, 16 Dec 2025 15:44:23 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/45157-keysight-accelerates-electronic-design-productivity-with-secure-ai-powered-assistants</link>
    </item>
    <item>
      <title>COMSOL Speeds Simulation with Expanded NVIDIA GPU Support for COMSOL Multiphysics® Version 6.4</title>
      <description>COMSOL announced the release of COMSOL Multiphysics® version 6.4, which introduces new features, major performance improvements and expanded capabilities for multiphysics modeling and simulation app development.</description>
      <content:encoded>
        <![CDATA[<p>COMSOL announced the release of COMSOL Multiphysics<sup>®</sup> version 6.4, which introduces new features, major performance improvements and expanded capabilities for multiphysics modeling and simulation app development. </p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/45081</guid>
      <pubDate>Wed, 26 Nov 2025 08:24:24 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/45081-comsol-speeds-simulation-with-expanded-nvidia-gpu-support-for-comsol-multiphysics-version-64</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/comsol-11-26-25.webp?t=1764164316" type="image/jpeg" medium="image" fileSize="122511">
        <media:title type="plain">comsol-11-26-25.jpg</media:title>
      </media:content>
    </item>
    <item>
      <title>Major News in COMSOL Multiphysics® Version 6.4</title>
      <description>COMSOL Multiphysics® version 6.4 introduces new modeling and productivity features, major performance improvements and expanded multiphysics capabilities.</description>
      <content:encoded>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: 0.15px; orphans: 2; text-align: start; widows: 2; word-spacing: 0px; display: inline !important; float: none;">COMSOL&nbsp;Multiphysics</span><sup style="box-sizing: border-box; font-style: normal; font-weight: 400; letter-spacing: 0.15px; orphans: 2; text-align: start; widows: 2; word-spacing: 0px;">®</sup><span style=" font-style: normal; font-weight: 400; letter-spacing: 0.15px; orphans: 2; text-align: start; widows: 2; word-spacing: 0px; display: inline !important; float: none;">&nbsp;version 6.4 introduces new modeling and productivity features, major performance improvements and expanded multiphysics capabilities.</span>
</p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/45051</guid>
      <pubDate>Tue, 18 Nov 2025 13:50:25 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/45051-major-news-in-comsol-multiphysics-version-64</link>
    </item>
    <item>
      <title>Keysight Completes Acquisition of Synopsys’ Optical Solutions Group and Ansys’ PowerArtist</title>
      <description>Keysight Technologies, Inc. announced the completion of its acquisition of the Optical Solutions Group from Synopsys, Inc. and PowerArtist from Ansys, Inc.</description>
      <content:encoded>
        <![CDATA[<p>Keysight Technologies, Inc. &nbsp;announced the completion of its acquisition of the Optical Solutions Group from Synopsys, Inc. and PowerArtist from Ansys, Inc.&nbsp;</p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/44903</guid>
      <pubDate>Mon, 20 Oct 2025 13:28:09 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/44903-keysight-completes-acquisition-of-synopsys-optical-solutions-group-and-ansys-powerartist</link>
    </item>
    <item>
      <title>Reimagining Possibilities for Next-Gen Simulation in RF EDA</title>
      <description></description>
      <content:encoded>
        <![CDATA[]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/44438</guid>
      <pubDate>Fri, 11 Jul 2025 00:00:00 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/44438-reimagining-possibilities-for-next-gen-simulation-in-rf-eda</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/New--44438.webp?t=1752160972" type="image/png" medium="image" fileSize="226588">
        <media:title type="plain">New- 44438.png</media:title>
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    <item>
      <title>Remcom Releases Next-Generation Wireless InSite</title>
      <description>Remcom announced a new version of Wireless InSite® 3D Wireless Prediction Software with advanced capabilities including time-based mobility, lunar propagation modeling and wideband ray-tracing with S-parameter outputs.</description>
      <content:encoded>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">Remcom announced a new version of Wireless InSite® 3D Wireless Prediction Software with advanced capabilities including time-based mobility, lunar propagation modeling and wideband ray-tracing with S-parameter outputs.</span></p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/43948</guid>
      <pubDate>Wed, 14 May 2025 10:05:17 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/43948-remcom-releases-next-generation-wireless-insite</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/Remcom-5-14-25.webp?t=1748979744" type="image/jpeg" medium="image" fileSize="199312">
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    <item>
      <title>COMSOL Conference 2025 to Kick Off in Boston</title>
      <description>COMSOL announced that the first stop of its worldwide COMSOL Conference 2025 tour will be held in Boston, Mass., on October 8–10.</description>
      <content:encoded>
        <![CDATA[<p>COMSOL announced that the first stop of its worldwide COMSOL Conference 2025 tour will be held in Boston, Mass., on October 8–10.&nbsp;</p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/43831</guid>
      <pubDate>Tue, 29 Apr 2025 16:15:40 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/43831-comsol-conference-2025-to-kick-off-in-boston</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/Comsol-4-29-25.webp?t=1745958139" type="image/jpeg" medium="image" fileSize="176985">
        <media:title type="plain">Comsol-4-29-25.jpg</media:title>
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    </item>
    <item>
      <title>New Stable Release of PicoScope 7.1.50 Brings Advanced Tools and Enhanced Performance</title>
      <description>Pico Technology Ltd. has released PicoScope 7.1.50 Test &amp; Measurement — the latest stable version of the software.</description>
      <content:encoded>
        <![CDATA[<p>Pico Technology Ltd. has released PicoScope 7.1.50 Test & Measurement — the latest stable version of the software.</p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/43807</guid>
      <pubDate>Tue, 22 Apr 2025 08:38:38 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/43807-new-stable-release-of-picoscope-7150-brings-advanced-tools-and-enhanced-performance</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/Pico-4-22-25.webp?t=1745325896" type="image/jpeg" medium="image" fileSize="191593">
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    <item>
      <title>Maury Microwave Introduces InsightPro, A Next-generation Measurement and Modeling Software Platform</title>
      <description>Maury Microwave announced the official launch of InsightProTM — their next-generation unified software suite designed to accelerate measurement and modeling workflows across R&amp;D, design verification/validation and small-scale production.</description>
      <content:encoded>
        <![CDATA[<p>Maury Microwave announced the official launch of InsightPro<sup>TM&nbsp;</sup>— their next-generation unified software suite designed to accelerate measurement and modeling workflows across R&D, design verification/validation and small-scale production.&nbsp;</p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/43739</guid>
      <pubDate>Wed, 16 Apr 2025 08:00:03 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/43739-maury-microwave-introduces-insightpro-a-next-generation-measurement-and-modeling-software-platform</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/Maury-4-16-25.webp?t=1744804855" type="image/jpeg" medium="image" fileSize="105472">
        <media:title type="plain">Maury-4-16-25.jpg</media:title>
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    <item>
      <title>Siemens Acquires Altair to Create Most Complete AI-Powered Portfolio of Industrial Software</title>
      <description>Siemens announced that it has completed the acquisition of Altair Engineering Inc.</description>
      <content:encoded>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">Siemens announced that it has completed the acquisition of Altair Engineering Inc.</span></p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/43593</guid>
      <pubDate>Wed, 26 Mar 2025 09:21:02 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/43593-siemens-acquires-altair-to-create-most-complete-ai-powered-portfolio-of-industrial-software</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/Siemens-3-26-25.webp?t=1742995712" type="image/jpeg" medium="image" fileSize="129251">
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    <item>
      <title>Remcom Announces Huygens Antennas to Integrate On-body Near-field and Far-field Electromagnetic Modeling in Dynamic Scenarios</title>
      <description>Remcom announced the integration of XFdtd® 3D Electromagnetic Simulation Software with Wireless InSite® 3D Wireless Propagation Software through a new Huygens surface capability.</description>
      <content:encoded>
        <![CDATA[<p>Remcom announced the integration of XFdtd® 3D Electromagnetic Simulation Software with Wireless InSite® 3D Wireless Propagation Software through a new Huygens surface capability. </p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/43137</guid>
      <pubDate>Tue, 10 Dec 2024 09:34:58 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/43137-remcom-announces-huygens-antennas-to-integrate-on-body-near-field-and-far-field-electromagnetic-modeling-in-dynamic-scenarios</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/remcom-12-10-24.webp?t=1733841842" type="image/jpeg" medium="image" fileSize="86016">
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    <item>
      <title>COMSOL Releases Version 6.3 of COMSOL Multiphysics®</title>
      <description>COMSOL announced the release of COMSOL Multiphysics® version 6.3, which delivers new features and capability updates for efficient physics modeling and simulation app development.</description>
      <content:encoded>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">COMSOL announced the release of COMSOL Multiphysics® version 6.3, which delivers new features and capability updates for efficient physics modeling and simulation app development.</span>
</p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/43061</guid>
      <pubDate>Tue, 19 Nov 2024 15:35:10 -0500</pubDate>
      <link>https://www.microwavejournal.com/articles/43061-comsol-releases-version-63-of-comsol-multiphysics</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/Comsol-11-19-24.webp?t=1732048921" type="image/jpeg" medium="image" fileSize="80590">
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    <item>
      <title>Siemens to Acquire Altair for $10.6 B</title>
      <description>Siemens is to buy U.S. engineering software firm Altair Engineering for $10.6 billion, strengthening its position in the growing market for industrial software.</description>
      <content:encoded>
        <![CDATA[<p>Siemens is to buy U.S. engineering software firm Altair Engineering for $10.6 billion, strengthening its position in the growing market for industrial software.</p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/42935</guid>
      <pubDate>Fri, 01 Nov 2024 13:34:19 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/42935-siemens-to-acquire-altair-for-106-b</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/siemens-11-1-24.webp?t=1730483427" type="image/jpeg" medium="image" fileSize="46411">
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      </media:content>
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    <item>
      <title>Comsol Conference Boston 2024 - Preview of Version 6.3</title>
      <description></description>
      <content:encoded>
        <![CDATA[]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/blogs/9/post/42816</guid>
      <pubDate>Tue, 08 Oct 2024 17:12:33 -0400</pubDate>
      <link>https://www.microwavejournal.com/blogs/9-pat-hindle-mwj-editor/post/42816-comsol-conference-boston-2024-preview-of-version-63</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/2024/10/08/Keynote.webp?t=1728423436" type="image/jpeg" medium="image" fileSize="114109">
        <media:title type="plain">Comsol 6.3</media:title>
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      <title>Remcom to Provide NASA with Lunar Wireless Channel Simulation for LunaNet</title>
      <description>Remcom has been awarded a Small Business Innovative Research (SBIR) Phase II contract to provide NASA with mission-critical capabilities for wireless channel simulation and coverage analysis for lunar environments.</description>
      <content:encoded>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">Remcom has been awarded a Small Business Innovative Research (SBIR) Phase II contract to provide NASA with mission-critical capabilities for wireless channel simulation and coverage analysis for lunar environments. </span>
</p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/42528</guid>
      <pubDate>Thu, 22 Aug 2024 10:04:58 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/42528-remcom-to-provide-nasa-with-lunar-wireless-channel-simulation-for-lunanet</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/Remcom-8-22-24.webp?t=1724336365" type="image/jpeg" medium="image" fileSize="122162">
        <media:title type="plain">Remcom-8-22-24.jpg</media:title>
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      <title>Ansys 2024 R2 Delivers Multiphysics Innovation Across Industries and Engineering Domains </title>
      <description>Ansys 2024 R2 redefines the boundaries of product design by enabling customers to move beyond the limits of single-physics simulation to gain multidimensional insight into the performance of today’s complex products.</description>
      <content:encoded>
        <![CDATA[<p>Ansys 2024 R2 redefines the boundaries of product design by enabling customers to move beyond the limits of single-physics simulation to gain multidimensional insight into the performance of today’s complex products.</p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/42373</guid>
      <pubDate>Tue, 23 Jul 2024 14:17:26 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/42373-ansys-2024-r2-delivers-multiphysics-innovation-across-industries-and-engineering-domains</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/ansys-7-23-24.webp?t=1721759212" type="image/jpeg" medium="image" fileSize="87853">
        <media:title type="plain">ansys-7-23-24.jpg</media:title>
      </media:content>
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      <title>RF Design Migration Flow </title>
      <description>Keysight, Synopsys and Ansys introduce a new integrated RF design migration flow from TSMC's N16 process to its N6RF+ technology.</description>
      <content:encoded>
        <![CDATA[<p>Keysight, Synopsys and Ansys introduce a new integrated RF design migration flow from TSMC's N16 process to its N6RF+ technology.</p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/41833</guid>
      <pubDate>Wed, 24 Apr 2024 09:30:59 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/41833-keysight-synopsys-and-ansys-deliver-rf-design-migration-flow-to-tsmcs-n6rf-process-node</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/keysight-4-24-24.webp?t=1713974199" type="image/jpeg" medium="image" fileSize="125586">
        <media:title type="plain">keysight-4-24-24.jpg</media:title>
      </media:content>
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    <item>
      <title>Keysight Introduces Next-Generation RF Circuit Simulator for RFIC Chip Designers</title>
      <description>Keysight Technologies, Inc. introduces RFPro Circuit, a next-generation RF simulation tool targeting the complex, multi-physics requirements of today's RFIC designers.</description>
      <content:encoded>
        <![CDATA[<p>Keysight Technologies, Inc. introduces RFPro Circuit, a next-generation RF simulation tool targeting the complex, multi-physics requirements of today's RFIC designers. </p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/41809</guid>
      <pubDate>Thu, 18 Apr 2024 11:58:34 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/41809-keysight-introduces-next-generation-rf-circuit-simulator-for-rfic-chip-designers</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/2024/04/24/keysight-4-18-24wjt.webp?t=1714004182" type="image/jpeg" medium="image" fileSize="43878">
        <media:title type="plain">keysight-4-18-24wjt.jpg</media:title>
      </media:content>
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      <title>COMSOL Conference 2024 to Kick Off in Boston</title>
      <description>The first stop of the worldwide COMSOL Conference 2024 tour is slated to be held in Boston, Mass., on October 2–4.</description>
      <content:encoded>
        <![CDATA[<p>The first stop of the worldwide COMSOL Conference 2024 tour is slated to be held in Boston, Mass., on October 2–4. </p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/41776</guid>
      <pubDate>Wed, 10 Apr 2024 10:58:54 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/41776-comsol-conference-2024-to-kick-off-in-boston</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/comsol-boston2024.webp?t=1712762599" type="image/jpeg" medium="image" fileSize="264113">
        <media:title type="plain">comsol-boston2024.jpg</media:title>
      </media:content>
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      <title>Ansys and NVIDIA Pioneer Next Era of Computer-Aided Engineering  </title>
      <description>Ansys announced a collaboration with NVIDIA to develop next-generation simulation solutions powered by accelerated computing and generative AI.</description>
      <content:encoded>
        <![CDATA[<p><span style=" font-style: normal; font-weight: 400; letter-spacing: normal; orphans: 2; text-align: left; widows: 2; word-spacing: 0px; display: inline !important; float: none;">Ansys announced a collaboration with NVIDIA to develop next-generation simulation solutions powered by accelerated computing and generative AI.</span>
</p>]]>
      </content:encoded>
      <guid>http://www.microwavejournal.com/articles/41708</guid>
      <pubDate>Tue, 26 Mar 2024 09:48:44 -0400</pubDate>
      <link>https://www.microwavejournal.com/articles/41708-ansys-and-nvidia-pioneer-next-era-of-computer-aided-engineering</link>
      <media:content url="https://www.microwavejournal.com/ext/resources/images/Newsletters/News/News_1/ansys-3-26-24.webp?t=1711461356" type="image/jpeg" medium="image" fileSize="186391">
        <media:title type="plain">ansys-3-26-24.jpg</media:title>
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