Materials/Packages

Efficacy of Different Test Methods for Low-Loss Dielectrics

Tue, 07 Jun 2022 00:00:00 -0400

Df is important for prediction of insertion loss in passive devices. If insertion loss is higher than predicted, then power transfer through a device may be too low and a higher power transmitter or more elements would be necessary. Presented here are four methods of extracting Dk and Df from dielectric samples of an unknown material and the pros and cons of each.

State-of-Technology Update On GRIN/Luneburg Dielectric Lenses/Antennas for Microwave/mmWave Applications

Tue, 01 Feb 2022 11:38:00 -0500

GRIN dielectric lenses/antennas have been a hot topic of research for virtually every microwave/mmWave application, from military/defense, aerospace/space, to commercial telecommunications. There have even been several companies, products, and government/DoD grants using GRIN dielectric lens/antenna technology. This article provides some discussion around recent research (since 2018) on GRIN dielectric lenses/antennas, and an overview of GRIN dielectric lenses/antennas being deployed or intended for practical use.

Millimeter-wave Hits The Mainstream, Along With All The Challenges of High Frequency Design & Fabrication

Mon, 25 Oct 2021 00:00:00 -0400

The barriers to entry of developing and deploying mmWave communication and sensing technologies has largely been a result of the design and manufacturing complexity which tends to increase as a function of frequency. There are several key factors - learn about them in this article.

RF PCB Thermal Management Fabrication Methods

Sun, 05 Sep 2021 21:07:00 -0400

This article is from Chapter 4 of the eBook "The Printed Circuit Designer's Guide to...Thermal Management: A Fabricator's Perspective" authored by Anaya Vardya, CEO, American Standard Circuits, and published on iConnect007 here.

Longest Multilayer Flexible Printed Circuit Spans 26 m/85 ft Wings of UAV

Wed, 27 Mar 2019 09:58:00 -0400

Trackwise has shipped a 26 meter long multilayer, flexible printed circuit (FPC), believed to be world’s longest ever produced, for distributing power and control signals across the wings of a solar-powered, unmanned aerial vehicle (UAV). The circuit is one of over fifty supplied by Trackwise into this vehicle.

Isola Sells Existing Arizona Facility, Plans for New Facility Early 2020

Thu, 30 Aug 2018 16:46:00 -0400

Isola Group announced it has reached an agreement to sell its Chandler, Ariz. production facility to Rogers Corp.

AT&S Offers Interconnection Technologies for Next-Generation 5G Mobile Communications

Wed, 20 Jun 2018 14:56:00 -0400

AT&S is supporting the current roll-out of the 5G mobile communications generation with high frequency (HF) optimized interconnect solutions and will continue to offer corresponding solutions as the new standard develops.

Silicon Breakthrough Could Lead to Bendable Electronics

Wed, 14 Mar 2018 00:00:00 -0400

University of Glasgow engineers have scaled up the established processes for making flexible silicon chips to the size required for delivering high-performance bendable systems.

Ampleon Launches Devices Using Gen9HV 50 V Process Optimized for Base Stations

Tue, 06 Jun 2017 00:00:00 -0400

Ampleon launched a series of LDMOS RF power transistors fabricated with its Gen9HV 50 V LDMOS process.

EPSRC Grant to Develop GaN-on-Diamond Microwave Technology

Mon, 13 Feb 2017 00:00:00 -0500

The University of Bristol has been awarded a £4.3 million grant from the Engineering and Physical Sciences Research Council to lead a new project to develop GaN-on-Diamond microwave technology.

Indium's new solder paste technology exhibits best-in-class non-wet open performance

Tue, 22 Mar 2016 17:02:00 -0400

Indium Corp.'s new Indium10.8HF is a halogen-free, no-clean solder paste that is formulated to provide industry-leading non-wet open performance on large, high IO electronic packages, such as microprocessors.

Ampleon begins business with commitment to the future

Mon, 07 Dec 2015 00:00:00 -0500

As Ampleon opens for business its CEO commits the company to continued development of mobile broadband initiatives, significant advancement of its RF energy activity and increased investment in R&D.

University of Glasgow researchers make graphene production breakthrough

Fri, 20 Nov 2015 00:00:00 -0500

Research led by the University of Glasgow has produced large-area graphene around 100 times cheaper than ever before.

DelfMEMS’ RF-MEMS ohmic switch passes one billion operations milestone

Mon, 01 Jun 2015 11:18:00 -0400

DelfMEMS announced that its twelve throw, RF-MEMS ohmic contact switch design has just passed the one billion test cycles milestone and is still going strong.

Teledyne Microwave Solutions invests in Teledyne Labtech Presteigne facility

Tue, 14 Oct 2014 10:18:00 -0400

Teledyne Microwave Solutions has invested in the Teledyne Labtech facility at Presteigne, Wales, following the recent completion of the installation of the new Shadow Line processing equipment in support of increased production requirements.

New web site strengthens Remtec's position as leader in providing ceramic packaging solutions

Tue, 17 Jun 2014 16:07:00 -0400

Remtec Inc., the leading manufacturer of substrates and packages using Plated Copper On Thick Film (PCTF®) metallization, has completed a new, comprehensive web site www.remtec.com that strengthens Remtec's position as the leader in providing ceramic solutions for DC power electronics, optoelectronics and RF/MW applications.

T-Tech Inc. & The Geek Group partner to provide PCB design/prototyping

Thu, 05 Jun 2014 16:47:00 -0400

T-Tech Inc. and The Geek Group announced a joint agreement to offer a state of the art solution and facility for rapid printed circuit board (PCB) design, verification, and fabrication. The collaboration will combine T-Tech's QCJ5 series Quick Circuit System and IsoPro® Software for PCB prototyping with The Geek Group's expertise and 43,000 square foot Leonard Street Labs Facility in Grand Rapids, Michigan.

Indium Corp. VP of technology to present at ECTC

Fri, 16 May 2014 08:20:57 -0400

Indium Corp.'s Dr. Ning-Cheng Lee, vice president of technology, will teach a professional development course at the Electronic Components and Technology Conference (ECTC) May 27-30 in Lake Buena Vista, Florida.

Remtec develops new, cost-effective gold tin plating technique

Fri, 09 May 2014 10:11:53 -0400

Remtec Inc., the leading manufacturer of substrates and packages using plated copper on thick film (PCTF) metallization, has adapted its gold-tin plating technology on metallized ceramics to include a newly developed technique of selectively applying AuSn deposits for interconnecting RF and microwave electronic components, lead frames and other miniature parts on high frequency PC boards.

Indium Corp. technology experts to present at PCIM Europe

Wed, 07 May 2014 16:05:00 -0400

Indium Corp. technology experts will present at PCIM Europe May 20–22 in Nuremberg, Germany

North American debut of first ever hybrid milling/laser prototyping system by LPKF

Tue, 06 May 2014 16:21:20 -0400

Attendees of the 2014 International Microwave Symposium (IEEE-IMS) Exhibition will have the opportunity to see printed circuit boards made live and in-person by visiting LPKF Laser & Electronics in booth #1108. LPKF has announced that they will be debuting the first ever hybrid milling/laser prototyping system, the ProtoMat D104. Also at the show will be a UV laser prototyping system, the ProtoLaser U3. The show will be hosted in Tampa, FL., June 3-5 at the Tampa Convention Center.

Rogers Corp. releases video on innovation center opening

Mon, 05 May 2014 16:16:00 -0400

Rogers Corp. held a ribbon-cutting ceremony to dedicate the company’s new Innovation Center in Burlington, Massachusetts on March 25. More than 125 government officials, community leaders, technology company representatives and other guests were on hand to celebrate and tour the Center, which is located within Northeastern University’s George J. Kostas Research Institute for Homeland Security.

SemiGen's automated PCB assembly outsource handles VGAs and more

Fri, 18 Apr 2014 14:27:07 -0400

SemiGen Inc. (www.semigen.net), an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, provides high-quality, automated PCB assembly for high-mix, low- to medium-volume printed circuit boards.

Agilent installs atomic force microscope at Cambridge Graphene Centre

Mon, 27 Jan 2014 00:00:00 -0500

Agilent Technologies announced the recent installation of an Agilent 5600LS atomic force microscope with scanning microwave microscopy at the Cambridge Graphene Centre (CGC), in the UK.

Soitec manufactures new eSI substrates for 4G LTE advanced smartphones

Mon, 09 Dec 2013 00:00:00 -0500

Soitec has reached high-volume manufacturing of its new Enhanced Signal Integrity™ (eSI) substrates, enabling cost-effective and high-performance RF devices. The eSI products are said to be the first ‘trap-rich’ type of material in full production.

NXP introduces first 3 A transistors in 1.1 mm² leadless plastic package

Mon, 04 Nov 2013 00:00:00 -0500

NXP Semiconductors has introduced the first transistors in a 1.1 mm by 1 mm by 0.37 mm low-profile discrete flat no-leads (DFN) package that boost current capabilities up to 3.2 A.

Nujira selects ASE as packaging and test partner for handset ET chip

Mon, 09 Sep 2013 00:00:00 -0400

Nujira Ltd.has selected ASE as its production packaging and test partner for its Coolteq.L family of High Accuracy Tracking Envelope Tracking ICs.

Isola expands production of RF/microwave materials in Germany to support European OEMs

Mon, 15 Jul 2013 00:00:00 -0400

Isola Group S.a.r.l.announced that its six-member IS680 copper-clad laminate family is now in production at its facility in Dueren, Germany.

PCB Considerations For Defected Structures

Wed, 04 Apr 2012 00:00:00 -0400

As strange as it may sound, the use of circuit defects is a growing trend in high-frequency circuit design, especially for passive circuits such as filters. More precisely, the trend is in the increased use of defected ground structures (DGSs) and defected microstrip structures (DMSs) to alter the responses of microstrip circuit designs. Just what are these DGS and DMS forms, and does incorporating them into a high-frequency circuit change the way the PCB material should be specified?

Learning To Launch Onto Different Circuit Thicknesses

Tue, 20 Mar 2012 00:00:00 -0400

The transition, from a waveguide or coaxial connector to the PCB, is critical to the performance of the circuit, and the PCB’s thickness can impact how an end launch transition is made. Waveguide and coaxial connectors come in many shapes and sizes, as do PCB thicknesses, and matching the connector to the substrate thickness can play a large role in the overall performance and reliability of that design.