Items Tagged with 'conversion'

ARTICLES

Ducommun LaBarge Technologies introduces mmWave externally biased balanced mixers

It is always a concern at high millimeter wave band that there is not enough power to drive the mixer, especially full waveguide band. Model FDB-XX-E1 series externally biased, balanced mixers is especially developed for this purpose. The mixers are offered in four waveguide bands to cover frequency spectra from 50 to 140 GHz. These mixers employ high performance GaAs Schottky beamlead diodes and balanced configuration to produce superior performance with a very low LO pumping level.


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ADI's integrated transceiver and support ecosystem drive next-generation SDR designs

Analog Devices Inc. introduced a revolutionary solution for software defined radio (SDR) applications. Designed to enable programmable radio applications that operate over a wide range of modulation schemes and network specifications such as defense electronics, instrumentation equipment and communications infrastructure, the new AD9361 RF Agile Transceiver achieves best-in-class performance, high integration, wideband operation and flexibility.


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ADI sets new standard in mixed-signal control processors revolutionizing industrial motor and solar inverter designs

Analog Devices Inc., a global leader in high-performance signal processing technology, launched a mixed-signal control processor that integrates the industry’s only embedded dual 16-bit A/D converter with up to 14 bits of accuracy together with a 240-MHz floating-point ARM® Cortex™-M4 processor core. Equipment manufacturers require highly accurate, closed-loop control in servo, motor-drive, solar photo-voltaic (PV) inverter and other embedded industrial applications to improve the energy efficiency and performance of their products.


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AEM's tin whisker mitigation process assures surface-mount component reliability

AEM Inc. announces a hirel-qualified Sn/Pb (tin/lead) conversion process designed to mitigate the formation of tin whiskers in surface-mount components. The AEM process eliminates potential damage to sensitive electronic devices caused by conventional hot-solder dippingwhile ensuring that converted component terminations con­tain a minimum of 5 percent Pb as verified by SEM/EDS and XRF inspection methods.


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