Picocom announced that through close partnership with Radisys, they are delivering joint 5G Open RAN platforms to customers based on Picocom’s PC802 small cell SoC and Radisys’ Connect RAN 5G software.
Partners with Infineon Technologies and ThinkSeed Systems for secure ranging and location in IoT applications
January 5, 2022
Mauna Kea Semiconductors (MKSemi) announced the closing of Series Pre-A+ funding totaling $12.8 million led by Lightspeed China Partners with participation by marquee investors Qiming Venture and Ivy Capital.
BMW Group selects Vision Perception, Vision System-on-Chip and ADAS Central Compute System-on-Chip from Qualcomm Technologies’ Snapdragon Ride ADAS Platform for its next generation of ADAS and autonomous driving systems.
MaxLinear Inc. announced the immediate availability of a power management integrated circuit, the XR77103-MoCA, designed to meet the power needs of MaxLinear MxL370x MoCA 2.0 and MxL371x MoCA 2.5 SoCs.