White Papers

Failure Analysis for Reliable 5G mmWave Infrastructure

In this white paper, learn how failure analysis helps create reliable 5G mmWave network infrastructure, why multiple failure analysis testing processes improve system quality, and which failure analysis techniques are most effective at improving quality and yields of mmWave systems.

GaN Ka-band Amplifiers for Satcom Applications

This white paper offers an overview of the advantages of gallium nitride (GaN) for high and moderate power levels in Ka-band satellite communications applications. The paper includes a discussion of the RF power amplification challenges presented by Ka-band data transmission, including the need for high power transmission, wide bandwidth and high linearity. Altum RF’s family of GaN amplifiers is presented, with illustrations of how these components suit specific scenarios within Ka-band satcom applications. The paper concludes with a demonstration of the importance of accurate modelling of electrical and thermal effects for these applications, given the high power levels and high frequencies required.

Important Concepts for Automating CMT USB VNAs

CMT VNAs are USB-based and do not have built-in computers. There are benefits to having the VNA measurement module separate from the processing module. The USB VNAs must run with an external PC and the VNA to work. You can consider the VNA software as the driver for VNAs.

Overcome mmWave Design Challenges

Millimeter-wave frequencies and mixed fabrication technologies mean new challenges for circuit designers. Download the eBook, Four Secrets to Mastering Millimeter-Wave Communications Circuit Design, to learn how to achieve first-pass success. Get the information you need to assemble multi-technology structures and perform circuit, electromagnetic, and electrothermal analysis across technology boundaries.

Discrete RF Power Transistor, IMFET, or MMIC Amplifier, Which is Best?

RF Power semiconductors provide the amplification for a wide variety of applications, from MRI to broadcast transmitters, radar systems and cellular base stations. This paper covers component construction options available for all RF power amplifier technologies; discrete transistors, impedance matched field effect transistors (IMFETs), and MMIC amplifier ICs.

NewSpace Terminal Testing Challenges and Considerations

Today’s satellite communication systems combine features from legacy cellular networks and emerging wireless technologies. New constellations are under development that attempt to provide ubiquitous mobility and internet networks via satellites, ground stations and user terminals. Download our whitepaper to learn more about NewSpace user terminals, testing challenges and testing solutions.

Testing Embedded Microcontrollers Using Multiple Types of Modular Instruments

Embedded systems, used in applications ranging from toys to advanced aircraft, use microcontrollers to execute specialized operations within a more complex system. Most microcontrollers are mixed signal devices using a combination of analog and digital signals.

Reimagining Antenna Design Solutions for Next-Generation Mobile Devices

Innovation in next-generation mobile devices creates significant challenges for antenna implementation. 5G handsets have more than twice as many RF paths, and new industrial designs and button replacement add space constraints. Qorvo Antenna Solutions Reimagined (QASR) helps navigate space, design and performance challenges to harness the true power of antennas.

5G Evolution – on the Path to 6G

5G deployments have only recently started, and releases beyond R15 will continue to tap into the tremendous potential of 5G. However, as a new generation of cellular technology typically appears every 8-10 years, 6G can be expected around 2030. Download this white paper to explore the evolution from 5G to 6G from a service, air interface and network perspective.

Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver

3D-ICs integrate many dies that are densely packed, which leads to heat generation that causes performance issues. This white paper helps designers understand the cross-fabric thermal challenges introduced by 3D-ICs and explains how the Cadence® Celsius™ Thermal Solver helps designers analyze and develop strategies to mitigate this impact.