White Papers

Discrete RF Power Transistor, IMFET, or MMIC Amplifier, Which is Best?

RF Power semiconductors provide the amplification for a wide variety of applications, from MRI to broadcast transmitters, radar systems and cellular base stations. This paper covers component construction options available for all RF power amplifier technologies; discrete transistors, impedance matched field effect transistors (IMFETs), and MMIC amplifier ICs.

NewSpace Terminal Testing Challenges and Considerations

Today’s satellite communication systems combine features from legacy cellular networks and emerging wireless technologies. New constellations are under development that attempt to provide ubiquitous mobility and internet networks via satellites, ground stations and user terminals. Download our whitepaper to learn more about NewSpace user terminals, testing challenges and testing solutions.

Testing Embedded Microcontrollers Using Multiple Types of Modular Instruments

Embedded systems, used in applications ranging from toys to advanced aircraft, use microcontrollers to execute specialized operations within a more complex system. Most microcontrollers are mixed signal devices using a combination of analog and digital signals.

Reimagining Antenna Design Solutions for Next-Generation Mobile Devices

Innovation in next-generation mobile devices creates significant challenges for antenna implementation. 5G handsets have more than twice as many RF paths, and new industrial designs and button replacement add space constraints. Qorvo Antenna Solutions Reimagined (QASR) helps navigate space, design and performance challenges to harness the true power of antennas.

5G Evolution – on the Path to 6G

5G deployments have only recently started, and releases beyond R15 will continue to tap into the tremendous potential of 5G. However, as a new generation of cellular technology typically appears every 8-10 years, 6G can be expected around 2030. Download this white paper to explore the evolution from 5G to 6G from a service, air interface and network perspective.

Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver

3D-ICs integrate many dies that are densely packed, which leads to heat generation that causes performance issues. This white paper helps designers understand the cross-fabric thermal challenges introduced by 3D-ICs and explains how the Cadence® Celsius™ Thermal Solver helps designers analyze and develop strategies to mitigate this impact.

Reduce SWaP, Increase Performance of Phased Arrays with an Innovative Filtering Approach

The spectral environment is quickly changing today. It’s becoming more crowded, which is resulting in an increase in spectral noise. This is presenting a variety of new challenges for RF designers, both in terms of the architecture and power needed to transmit and receive signals and the types of jobs filters need to perform in receivers (Rx) and transmitters (Tx).

Can deterministic digital phased array control be delivered over fiber?

Reporting progress at Teledyne e2v to replace copper with fiber as the physical transport layer, connecting data converters to digital signal processors. The goal is to substantially simplify high-throughput data converter interconnect to enable remotely positioned converters. Exploiting lightweight optical fiber is seen as the key here, opening microwave RF systems to future innovation.

Spectrum Analyzer Fundamentals – Theory and Operation of Modern Spectrum Analyzers: Primer

As wireless devices and systems spread across every industry, spectrum analyzers serve as an essential RF test tool for characterizing signals and making frequency measurements. Download Rohde & Schwarz's definitive guide to understanding the technology behind spectrum analyzer measurements.

Integrated Hardened DSP on DAC/ADC ICs Improves Wideband Multichannel Systems

Over the past several decades, wireless system channel counts and bandwidths have steadily increased. The driving factors for these modern telecommunication, radar, and instrumentation systems are their data rate and overall system performance requirements. However, these requirements have also increased power envelopes and system complexities, making power density and component level features more important.