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Because PCBs are fundamental to electronic devices, they are used in a variety of defense, consumer electronics, telecommunications, healthcare and energy and power applications. This widespread adoption creates a significant market opportunity. However, PCB manufacturers and users must address challenges to continue to enable the mass market appeal and unique opportunities envisioned by the market forecasts and the electronics industry. These challenges and their solutions form the basis for the articles in this eBook. 

These articles will give the reader a good understanding of the fundamentals and challenges of PCB material selection, design and fabrication that must be addressed to create the solutions that the electronics industry needs to evolve. The first article investigates a new composite laminate material that uses standard/qualified PTFE-based paper and glass fabric layers to provide good dimensional stability and Z-axis CTE while also exhibiting low Dk and Df. The second and last articles look at the fabrication process. The second article offers excellent insight into the fabrication steps and what is necessary at each step to optimize circuit performance. The last article addresses considerations for high-frequency RF and high-speed digital multilayer boards. The third article discusses how new materials overcome the traditional challenges presented by high Dk/low Df materials. The fourth article addresses how to reliably bend and form PCBs in response to the emergence of applications requiring 3D solutions.

While mobile traffic is expected to increase by multiples, revenues at mobile network operators are expected to stay flat. This challenges network operators and radio manufacturers to manage a much higher data capability at the same total cost, which calls for a significant reduction in the cost per bit. Breaking these requirements down for 5G radios, the RF PAs need to support higher frequencies, significantly wider instantaneous bandwidths and high efficiency over a wide back-off range. These radios must also be capable of being linearized at levels below -50 dBc with digital predistortion. The semiconductor technologies capable of delivering those targets at a commercially viable price position are RF GaN-on-SiC and RF GaN-on-Si. Find out why in this technical article.

This IoT Special Focus eBook covers wireless power transfer and technology outlook, new AWGs and digitizers, a new dual band patch antenna design and new products from various companies.

Fortify has built a portfolio of high-performance low-loss gradient dielectric devices that improve antennas using Fortify’s tailored design and manufacturing technologies for gradient-refractive index components. Taking a close look at gradient-dielectric enhanced antennas and adjacent systems, this guide covers examples of upgraded devices and their applications that Fortify has either built-to-print or designed and manufactured to transform and enhance antennas systems.

Humans are exposed to electromagnetic fields (EMF) from sources like 5G, IoT devices, and EV systems. Altair® Feko® enables engineers to evaluate EMF safety early in design—when corrections are least costly to make—helping manufacturers meet regulations efficiently. Download the paper now to explore EMF compliance solutions with Altair® Feko®.

Mobile data traffic continues to grow. Constant video streaming is on the rise in applications like TikTok, Netflix and Instagram, but also increasingly LinkedIn and even simple websites. Ericsson estimates that mobile data traffic, excluding fixed wireless access, is going to increase by a factor of 3x by 2029. 

This whitepaper provides a glimpse of the trends in mobile telecommunications spectrum allocation for 6G, how radio architectures are evolving to make the best use of this spectrum, and the innovations taking place in advancing RF Front End (RFFE) technology to make 6G possible.

The appetite for high data rate and ubiquitous terrestrial connectivity has stimulated huge investment in low Earth orbit (LEO) constellation systems. Low orbit significantly reduces launch and equipment costs, cuts latency by 20× compared with GEO links, and manages bandwidth and users more efficiently.

The demand for increased bandwidth in data communications is continually increasing, and the integrity of RF signals has become a major design concern. In broadband bias applications, most inductors do not cover enough impedance bandwidth. This paper discusses the proper use of broadband chokes in bias tees and critical design considerations including frequency range, DC resistance and current requirements.

In the last decade, the satellite communications (SATCOM) market has redefined the opportunity and the differentiator for this segment. Early business models that relied on providing voice services to the most remote areas of the globe have evolved to demonstrate how SATCOM can play a significant role in augmenting and improving terrestrial network connectivity. Component and system suppliers are excited because market research firms estimate the opportunity to be $50 to $70 billion by 2032. Including service revenue from applications that SATCOM capabilities will enable pushes these market opportunities to $200 billion in 2032, with the CAGR expected to be around 10 percent. With the “direct-to-device” opportunity of connecting cellular devices directly to satellites just emerging, there is a tremendous upside to these forecasts.