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VERSION:2.0
PRODID:icalendar-ruby
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-WR-CALNAME:Microwave Journal
BEGIN:VTIMEZONE
TZID:America/Detroit
BEGIN:DAYLIGHT
DTSTART:20210314T030000
TZOFFSETFROM:-0500
TZOFFSETTO:-0400
RRULE:FREQ=YEARLY;BYDAY=2SU;BYMONTH=3
TZNAME:EDT
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BEGIN:STANDARD
DTSTART:20211107T010000
TZOFFSETFROM:-0400
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BEGIN:VEVENT
DTSTAMP:20260625T031702Z
UID:0dbb3bdb-b5c8-4afc-81f4-3086ddff8e7f
DTSTART;TZID=America/Detroit:20210811T100000
DTEND;TZID=America/Detroit:20210811T103000
DESCRIPTION:\n\nEDI CON Online Webinar Series\n\nhttps://www.microwavejourn
 al.com/events/2088-edi-con-online-august-11-keynote-semi-additive-pcb-proc
 ess-new-possibilities-from-pcb-design-to-product-performance
LOCATION:
SUMMARY:EDI CON Online AUGUST 11 KEYNOTE: Semi-Additive PCB Process: New Po
 ssibilities From PCB Design to Product Performance
URL;VALUE=URI:
END:VEVENT
END:VCALENDAR