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Which PCB Laminate Properties Impact Thermal Stability?


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11/9/22 11:00 am to 12:00 pm EST

Event Description

Technical Education Webinar Series

Title: Which PCB Laminate Properties Impact Thermal Stability?

Date: November 9, 2022

Time: 8am PT / 11am ET

Sponsored by: Rogers Corporation

Presented by: John Coonrod, Technical Marketing Manager, and John Ekis, Market Segment Director for Aerospace and Defense, Rogers Corporation 


As circuit technology continues to advance, many new applications will require design engineers to address more complicated thermal management issues. Thermal management for RF circuits have several dependencies and interactions, which can complicate the process of optimizing thermal management designs. Some of these issues are related to the circuit design, some are related to the circuit construction. Circuit materials have an influence and the process of making the circuit can impact the thermal performance of a circuit. Additionally, the heat source can come from different mechanisms and some of those, can interact with each other. This webinar will start with a short overview of heat flow concepts and basic thermal management principles for RF PCB’s. Defining the variables associated with different heat sources will be considered and then critical circuit material properties for thermal management will be addressed. Measured data will be shown to support some of the thermal concepts discussed and thermal performance for different RF circuit structures will be shown. The agenda for the webinar:

  • Overview of heat flow and basic thermal management concepts
  • How to address thermal management due to different heat sources
  • Critical circuit material properties for thermal management
  • Measured data with comparisons of different materials and different RF structures

Presenter Bios:

John Coonrod is the Technical Marketing Manager for Rogers Corporation’s, Advanced Electronics Solutions. John has 34 years of experience in the Printed Circuit Board industry. About half of this time was spent in the Flexible Printed Circuit Board industry regarding circuit design, applications, processing, and materials engineering. The past twenty years have been spent supporting High Frequency Circuit materials involving circuit fabrication, providing application support, and conducting electrical characterization studies. John is the Chair for the IPC D24C High Frequency Test Methods Task Group and holds a Bachelor of Science, Electrical Engineering degree from Arizona State University.

John Ekis has over 35 years experience in Electronic materials and RF component and subsystems, including 15+ years directly in support of defense electronics. John’s career began in Process Engineering and R&D specializing in Multi-Layer Electronic Ceramics before transitioning into business development and market facing roles. He is currently the Market Segment Director for Aerospace and Defense at Rogers Corporation, where he is working on positioning Advance Material technologies Rogers is developing into key Aerospace and Defense programs.

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