Technical Education Webinar Series

Title: Wideband RF Launches: Much More Than Footprints on PCBs

Date: May 17, 2022

Time: 8am PT / 11am ET

Sponsored by: Samtec

Presented by: Sandeep Sankararaman, Principal Engineer

Abstract:
As the demand for higher frequencies and wider bandwidths continue their relentless march upward, RF connectors need to keep up with, or even exceed, demands.  Mating the RF connector to a PCB or substrate requires careful consideration of several factors to get the full performance out of the connector.   This webinar will provide an understanding of what makes successful launches work, what knobs to turn and design guidelines to make connector launches perform well as the industry moves toward 100 GHz bandwidths.

Presenter Bio:
Sandeep has nearly 20 years of experience in signal and power integrity for IC packages, PCBs, PCB connectors and connectors for cable assemblies.