Technical Education Webinar Series
Title: Impact of Copper Properties on High Reliability, High Performance PCB Designs?
Date: December 8, 2021
Time: 8am PT / 11am ET
Sponsored by: Rogers Corporation
Presented by: John Coonrod, Technical Marketing Manager, Rogers Corporation
Copper is the backbone of the PCB industry, not to mention, most technologies worldwide. However, the copper used to build PCB’s is typically a copper foil. Due to how copper foil is made and applied for laminate manufacturing and PCB fabrication, it can have many influences on the performance of RF and digital circuitry. Generally, the copper foil attributes that can impact circuit performance have much less influence at lower frequencies or lower digital rates. Although nowadays there are many applications using millimeter-wave (mmWave) frequencies and very-High Speed Digital (very-HSD). At these high frequencies and fast digital speeds, there are several copper attributes that the design engineer should understand in detail to ensure their circuit design will not have unexpected performance issues.
This webinar will explore in detail many topics related to copper foil and the potential effects on mmWave performance as well as very-HSD performance. The agenda for this webinar follows:
- How copper foil is made, different copper foil types and treatments
- Copper foil grain structure and its impact on circuit fabrication, assembly and bending
- Copper surface roughness; surface roughness definitions and measurement techniques
- Introduction to the impact of copper surface roughness on mmWave and very-HSD performance
- Different circuit structures that are affected by copper surface roughness
- Measured data comparing different copper types for mmWave and very-HSD performance
- Different models for copper surface roughness, used for circuit performance prediction
is the Technical Marketing Manager for Rogers Corporation’s, Advanced Electronics Solutions. John has 34 years of experience in the Printed Circuit Board industry. About half of this time was spent in the Flexible Printed Circuit Board industry regarding circuit design, applications, processing, and materials engineering. The past twenty years have been spent supporting High Frequency Circuit materials involving circuit fabrication, providing application support, and conducting electrical characterization studies. John is the Chair for the IPC D24C High Frequency Test Methods Task Group and holds a Bachelor of Science, Electrical Engineering degree from Arizona State University.
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