Technical Education Webinar Series
Title: Building Grounded Coplanar Waveguide & Substrate Integrated Waveguide Structures for mmWave Frequencies
Date: October 20, 2021
Time: 8am PT / 11am ET
Sponsored by: Rogers Corporation
Presented by: Joey Kellner, Senior Market Segment Manager, Rogers Corporation and John Coonrod, Technical Marketing Manager for Rogers Corporation’s, Advanced Electronics Solutions
Circuit designs at millimeter-wave frequencies often include grounded coplanar waveguide (GCPW) and substrate integrated (SIW) wave guide structures due to their RF performance advantages for transmitting signals between RF MMICs and antenna structures. To assist RF designers in quickly achieving desired RF performance, this webinar will review recommendations for PCB fabrication tolerances to consider when designing for GCPW and SIW, also, it will review RF material selection criteria for formation of reliable structures containing micro vias.
The webinar will consist of the following agenda:
- Benefits of GCPW and SIW structures at mmWave
- PCB fabrication considerations for GCPW and SIW
- RF laminate considerations for GCPW and SIW
is a Senior Market Segment Manager for Rogers Corporation. Joey has over 20 years of industry experience, with the last 15 spent in engineering, product management and marketing roles at Rogers Corporation. In her current role, Joey works closely with automotive customers to understand and meet their RF material and commercial supply requirements. Joey holds a Bachelor of Science, Chemical Engineering degree from North Carolina State University, and a Master of Business Administration, specializing in Technology, Science and Engineering from Arizona State University.
is the Technical Marketing Manager for Rogers Corporation’s, Advanced Electronics Solutions. John has 34 years of experience in the Printed Circuit Board industry. About half of this time was spent in the Flexible Printed Circuit Board industry regarding circuit design, applications, processing, and materials engineering. The past twenty years have been spent supporting High Frequency Circuit materials involving circuit fabrication, providing application support, and conducting electrical characterization studies. John is the Chair for the IPC D24C High Frequency Test Methods Task Group and holds a Bachelor of Science, Electrical Engineering degree from Arizona State University.
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