Technical Education Webinar Series
Title: Thermal Analysis for MMIC and RF PCB Power Applications
Date: October 5, 2021
Time: 11am PT / 2pm ET
Sponsored by: Cadence
Presented by: David Vye, Senior Product Marketing Manager, Cadence
This webinar will highlight how the Cadence® Celsius™ Thermal Solver uses design data such as layout geometries, material properties, and dissipated power simulation results from Cadence Microwave Office® software to provide designers with thermal heat map visualization and operating temperature information. Using the Celsius Thermal Solver with Microwave Office software, RF designers have access to critical data impacting performance and reliability concerns and can investigate heat sinking strategies to best manage thermal dissipation.
By registering for this webinar, the details of your profile may be used by Microwave Journal®, the presenter and the sponsor to contact you by email.