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Thermal Analysis for MMIC and RF PCB Power Applications

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When

10/5/21 2:00 pm to 10/5/21 3:00 pm EST

Event Description

Technical Education Webinar Series

Title: Thermal Analysis for MMIC and RF PCB Power Applications

Date: October 5, 2021

Time: 11am PT / 2pm ET

Sponsored by: Cadence

Presented by: David Vye, Senior Product Marketing Manager, Cadence

Abstract:
This webinar will highlight how the Cadence® Celsius™ Thermal Solver uses design data such as layout geometries, material properties, and dissipated power simulation results from Cadence Microwave Office® software to provide designers with thermal heat map visualization and operating temperature information. Using the Celsius Thermal Solver with Microwave Office software, RF designers have access to critical data impacting performance and reliability concerns and can investigate heat sinking strategies to best manage thermal dissipation.

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