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Latest PCB Material Solutions for 5G Radio Access Networks

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When

9/15/21 11:00 am to 9/15/21 12:00 pm EST

Event Description

Technical Education Webinar Series

Title: Latest PCB Material Solutions for 5G Radio Access Networks

Date: September 15, 2021

Time: 8am PT / 11am ET

Sponsored by: Rogers Corporation

Presented by: John Hendricks, Market Segment Manager in the Advanced Electronics Solutions Business Unit, Rogers Corporation

Abstract:
5G wireless telecommunication networks are being rolled out around the world. There are significant technological differences with previous generation systems, and this has implications for the properties and performance requirements of PCB materials. This webinar will discuss these requirements in detail, and what circuit designers need to consider for 5G designs.

5G networks operate over a wider range of frequencies. This presentation will primarily cover the low and mid-band frequency ranges (sub-6 GHz), the different needs of power amplifiers and antennas, the implications for materials of Frequency Division Duplex (FDD) vs Time Division Duplex (TDD) systems, and the different requirements for massive-MIMO systems vs MIMO macrocells. The webinar will consist of the following agenda:

  • Market overview for 5G base stations
  • Material requirements
    • Power amplifiers
    • Antennas
  • PCB design and fabrication requirements

Presenter Bio:

John Hendricks graduated in 1984, from Manchester University in England, with a BSc in Physics. He then joined Marconi Defence Systems where he worked as a microwave engineer, before moving to the Test & Measurement Division at Rohde & Schwarz. In 1990, he joined Rogers Corporation, where he currently works as a Market Segment Manager in the Advanced Electronics Solutions Business Unit.

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