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Online Panel: UWB Location and Security Applications Coming to Market


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9/8/21 11:00 am to 12:00 pm EDT

Event Description

Online Panel Series

Title: UWB Location and Security Applications Coming to Market

Date: September 8, 2021

Time: 8am PT / 11am ET

Sponsored by: Rohde & Schwarz, FiRa Consortium, NXP Semiconductors and Qorvo

This panel will discuss the upcoming UWB capabilities being added to mobile devices that will enable new location and security applications including how UWB devices are being designed and tested to meet these new capabilities. New applications that sense a person’s position and automatically adjust and secure their environment will be discussed.

Moderator: Christopher Taylor, Director, RF & Wireless Components, Strategy Analytics
Panelist: Joerg Koepp, Market Segment Wireless Communications, Rohde & Schwarz
Panelist: Charlie Zhang, Board Chair, FiRa Consortium
Panelist: Charles Dachs, Vice President & General Manager Secure Embedded Transactions, NXP Semiconductors
Panelist: Mickael Viot, Director of Business Development (UWB), Qorvo

Panel Participant Bios:

Moderator – Strategy Analytics

Christopher Taylor, Director, RF & Wireless Components

Christopher Taylor, Director, RF & Wireless Components, provides market research and technology assistance to companies involved in high volume radio components for wireless systems including mobile phones, Wi-Fi and UWB systems. His experience includes 35 years in the semiconductor industry in digital, mixed-signal, optoelectronics, and electronic equipment and materials. Prior to Strategy Analytics, Mr. Taylor worked as a Product Marketing Manager at M/A-COM where he defined and managed the development and launch of CDMA handset transceiver ICs, RF switches, and related ICs for wireless systems. Before that, Mr. Taylor worked as the S. Korea marketing manager for Varian Semiconductor Equipment, and managed the sales and marketing activities of Applied Optronics, a semiconductor laser start-up. Prior to these positions, he was employed by GE Semiconductor as a business development analyst, and S.A.I.C., where he served as a staff scientist in electro optics technology.

Mr. Taylor holds an SM degree in Management Science from the Massachusetts Institute of Technology’s Sloan School of Management, an MS in Physics from Ohio State University, and a BS in Physics from Pennsylvania State University.

Rohde & Schwarz

Joerg Koepp, Market Segment Wireless Communications

Joerg Koepp is a Market Segment Manager responsible for driving the test & measurement business in mobile device testing market at Rohde & Schwarz. In this role he is also representing Rohde & Schwarz at the FiRa Consortium. Joerg has enjoyed a 30+ year career in a variety of fields of telecommunication starting as a young man with the repair of electromechanical telephone switching systems. Prior to joining Rohde & Schwarz, he worked as a system architect, project leader, director of system engineering and technology manager at Siemens and Nokia Siemens Networks.

FiRa Consortium

Charlie Zhang, Board Chair

Charlie (Jianzhong) Zhang is SVP and head of the Standards and Mobility Innovation Team at Samsung Research America, where he leads research, prototyping, and standards for 5G/6G and future multimedia networks. He is serving as the Board Chairman at the FiRa Consortium to help accelerate the adoption of UWB technology across industries globally. From 2009 to 2013, he served as the Vice Chairman of the 3GPP RAN1 working group and led development of LTE and LTE-Advanced technologies such as 3D channel modeling, UL-MIMO, CoMP, Carrier Aggregation for TD-LTE. He received his Ph.D. degree from the University of Wisconsin, Madison. Dr. Zhang is a Fellow of IEEE.

NXP Semiconductors

Charles Dachs, Vice President & General Manager Secure Embedded Transactions

Charles Dachs has dedicated his expertise to the establishment of secure mobile device technology as integral part of global infrastructures.

Working on advanced and emerging technologies for more than 20 years, Charles has held various leadership positions in Research and Development, Product Management, Marketing, and Business Development at NXP Semiconductors (former Philips company). In 2012, he took up the position as General Manager of NXP’s Secure Embedded Transactions business. For most of his career Charles has been involved in driving the secure mobile wallet adoption, contactless payments technology, and embedded security for mobile devices and wearables. He today fuels the integration of Ultra-Wideband technology into phones and IoT devices, eSIM convergence solutions and new mobile wallet use cases to constantly innovate the mobile transactions market. In addition to his role at NXP, Charles is the Board Vice-Chair of the FiRa Consortium since 2019 demonstrating his commitment to the creation of a holistic Ultra-Wideband ecosystem.


Mickael Viot, Director of Business Development (UWB)

Mickael Viot is a 20-year veteran of the high-tech industry. Mickael has extensive experience with complex technical customer offerings in the telecommunication and semiconductor domains, including project management, business development, strategic marketing and customer relationship building. For the past 6 years, Mickael has been driving all marketing activities at Decawave, now Qorvo. From the evangelization of Ultra-Wideband (UWB) technology, to defining products and enabling the adoption of UWB, to supporting customers in their projects. Mickael holds an EE MSc degree specializing in Embedded Systems from the Ecole Supérieure d'Ingénieur en Génie Electrique in Rouen, France, and an Executive MBA from UCD Michael Smurfit in Dublin, Ireland.