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Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver

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When

7/27/21 to 7/27/21 11:59 pm

Event Description

Technical Education Webinar Series

Title: Thermal and Stress Analysis of 3D-ICs with Celsius Thermal Solver

Date: On Demand

Sponsored by: Cadence

Presented by: Yun Dai - Manager, Product Engineering at Cadence and Melika Roshandell, Product Marketing Director at Cadence

Abstract:
This webinar addresses “thermal-aware” systems design for chips, packages, and boards and covers the thermal and stress challenges introduced by 3D-ICs, which are cross-fabric problems. Learn how the Cadence® Celsius™ Thermal Solver helps you solve this problem by producing thermal gradient for the whole system, enabling analysis from early design to signoff.

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