EDI CON Online
Title: 3D Aluminum Metal Additive Manufacturing Infiltrates the Microwave Component Industry
Date: September 11, 2019
Time: 8am PT / 11am ET
Sponsored by: Microwave Development Labs
Presented by: Tom McWalters, Mechanical Engineer, Microwave Development Laboratories, Gordon Riblet, President, Microwave Development Laboratories and John Kane, Electrical Engineer, Microwave Development Laboratories
Three-dimensional (3D) aluminum metal printing provides a means of producing RF/microwave passive components and component parts. Metal printed parts replace traditional "subtractive” and casting manufacturing methods. Three different microwave components will be examined. We will compare two additive manufactured parts traditionally manufactured as cast parts. We will also compare one additive manufactured part traditionally manufactured using the subtractive manufacturing method. Comparisons will include measured mechanical and electrical characteristics.
Tom McWalters is the Mechanical/Product Engineer at Microwave Development Labs. Tom has worked at MDL for the past 35 years. Tom manages all aspects of CAD at MDL. In his time at MDL, Tom has designed the following microwave components: rotary joints, rotary switches, power dividers and combiners, waveguide to coax adapters, and monopulse comparators.
Gordon Riblet received M.S. and Ph.D. degrees in physics from the University of Pennsylvania, PA, in 1966 and 1970, respectively. From 1970 to 1972, he was employed as a Research Scientist at the University of Cologne in Cologne, Germany, performing research in solid state physics. Since 1972, he has been employed at Microwave Development Laboratories in Needham, MA, where he is now President.
John Kane serves as a Design and Manufacturing Engineer at Microwave Development Laboratories, Inc. He has over 35 years of experience in the Microwave Design industry with an emphasis on HFSS modeling and measurement/test. John holds a BSEE from Southeastern Massachusetts University and US Patent #6822532.
To register for any EDI CON Online SI/PI events, please visit the Signal Integrity Journal website.
By registering, you are agreeing to allow the data collected to be shared with Microwave Journal®, Signal Integrity Journal™, the speakers & the sponsors of this event. You may be contacted regarding the subject matter presented.