EDI CON Online
Title: TrueVolume Meshing in Sonnet: A 3D Model for Thick Cross-Sections
Date: September 10, 2019
Time: 7:30am PT / 10:30am ET
Sponsored by: Sonnet Software, Inc.
Presented by: Dr. Brian Rautio, Vice President of Operations for Sonnet Software, Inc.
With modern microwave designs pushing the envelope with both frequency and metal cross-section, it is more important than ever to properly model thickness. With the upcoming TrueVolume subsetions from Sonnet, it will be possible to simulate the effects of full 3D currents and fields inside of a 3D-planar simulator. A live demonstration of the subsections, and their benefits to accuracy and performance precedes a Q&A.
Dr. Brian Rautio is the Vice President of Operations for Sonnet Software, Inc. He received the B.S.E.E. degree from Rensselaer Polytechnic Institute in 2009 and the Ph.D. degree in Electrical and Computer Engineering from Syracuse University in 2014, where his algorithm research helped him to win the All-University Doctoral Prize. Brian has been a member of IEEE since 2005, having previously volunteered for the IMS2012 steering committee and MTT AdCom, and is currently a reviewer for the MTT Transactions. He is also a member of the Eta Kappa Nu electrical and computer engineering honor society.
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