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Enabling the Next Wave of RF-Connected Things With Differentiated Silicon


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8/21/19 11:00 am to 8/21/19 12:00 pm EST

Event Description

Technical Education Webinar Series

Title: Enabling the Next Wave of RF-Connected Things With Differentiated Silicon

Date: August 21, 2019

Time: 8am PT / 11am ET

Sponsored by: GlobalFoundries

Presented by: Jamie Schaeffer, Senior Director of Product Offering Management at GlobalFoundries and Martin Mason, Senior Director of Leading-Edge eNVM at GlobalFoundries

Every thing is now connected. From Smart Cities to Smart Homes, all these connected things depend on wireless connectivity, with 5G, NB-IoT and BTLE advances now driving even more pervasive deployment of this next wave of linked devices.

There are conflicting constraints on silicon designs for these applications. The silicon must deliver the lowest power and the highest possible Quality of Service (RF connectivity), while empowering designers with the ability to minimize both cost and area.

Learn more about the semiconductor offerings targeted for NB-IoT in this evolving Internet of Things, the development challenges confronting chip designers for these applications, and the technology differentiators, such as MRAM and RF-optimized silicon-on-insulator, that are helping solution providers unlock opportunities in this rapidly growing segment.

Presenter Bios:

Jamie Schaeffer is Senior Director of Product Offering Management at GLOBALFOUNDRIES. Schaeffer is currently responsible for the FDXTM product offerings, including 22FDX® and 12FDXTM, which enable differentiated solutions for 5G, Auto, and IoT markets. Schaeffer has helped lead 22FDX® from inception to a program that is in early production with design wins valued at >$2B. Prior to this, Schaeffer had an extensive career in technology development at GLOBALFOUNDRIES, Freescale Semiconductor, and its predecessor Motorola Semiconductor Products Sector. Schaeffer helped lead the development and transfer into volume manufacturing of the 32nm and 28nm technologies and his earlier work in the semiconductor industry has been recognized with numerous invited talks and a Distinguished Innovator award for his contributions to technology innovation while at Freescale Semiconductor.

Schaeffer holds a bachelor’s degree in materials science and engineering from Cornell University and a Ph.D. in materials science and engineering from The University of Texas at Austin.

Martin Mason is the Senior Director of Leading-Edge eNVM at GLOBALFOUNDRIES (GF), where he manages all aspects of the advanced node eNVM technology strategy and deployment. Prior to joining GF, Martin worked for over 25 years in the semiconductor industry as a product line general manager for semiconductor companies whose products varied from FPGAs to non-volatile memories to high-precision mixed signal devices. Martin earned a B Eng (Hons) in Microelectronics from the University of Newcastle upon Tyne in the United Kingdom, holds more than a dozen US semiconductor-related patents and lives and works in Santa Clara, California.

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