Technical Education Webinar Series
Title: High Performance PCB Laminates & Modeling for MW/mmWave Applications
Date: May 23, 2019
Time: 8am PT / 11am ET
Sponsored by: COMSOL and Rogers Corp.
Presented by: Jiyoun Munn, Technical Product Manager for the RF Module at COMSOL and John Coonrod, Technical Marketing Manager at Rogers Corp.
The performance of microwave and millimeter wave circuits in the application areas of 5G, IoT, 77 GHz radars and satellite communications may vary with different PCB materials. Evaluation of the circuit before fabrication and test through electromagnetics simulation tools is beneficial to reduce the time and effort required in the design process during the development cycle. It is important to choose accurate material properties such as relative dielectric constant and loss tangent to get reliable simulation results. When higher frequency is need for 5G devices, the surface roughness of the conductive layer may not be negligible, so it should be included in the simulation as well.
In this webinar, you will see a live demonstration in the COMSOL Multiphysics® software showing how to set up and run a simulation to design and evaluate a Grounded Coplanar Waveguide (GCPW) line. We will investigate the impact on the performance of the circuit board by choosing different types of material and surface roughness models. There will be an overview of the Rogers PCB materials to overcome the effects of conductor surface roughness by selecting lower-profile copper foils for minimal surface-roughness effects and lower conductor losses at higher frequency applications.
This webinar will be presented with the following agenda:
Jiyoun Munn is the technical product manager for the RF Module at COMSOL and a senior member of IEEE. He has 2 decades of experience in the RF industry, creating more than 150 antenna and microwave device prototypes and holding patents for antenna interrogation systems. He has an MS in electrical engineering from the University of Michigan.
John Coonrod is the Technical Marketing Manager for Rogers Corporation’s, Advanced Connectivity Solutions. John has 30 years of experience in the Printed Circuit Board industry. About half of this time was spent in the Flexible Printed Circuit Board industry regarding circuit design, applications, processing and materials engineering. The past fifteen years have been spent supporting High Frequency Circuit materials involving circuit fabrication, providing application support and conducting electrical characterization studies. John is the Chair for the IPC D24C High Frequency Test Methods Task Group and holds a Bachelor of Science, Electrical Engineering degree from Arizona State University.
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