David Vye, MWJ Editor
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David Vye is responsible for Microwave Journal's editorial content, article review and special industry reporting. Prior to joining the Journal, Mr. Vye was a product-marketing manager with Ansoft Corporation, responsible for high frequency circuit/system design tools and technical marketing communications. He previously worked for Raytheon Research Division and Advanced Device Center as a Sr. Design Engineer, responsible for PHEMT, HBT and MESFET characterization and modeling as well as MMIC design and test. David also worked at M/A-COM's Advanced Semiconductor Operations developing automated test systems and active device modeling methods for GaAs FETs. He is a 1984 graduate of the University of Massachusetts at Dartmouth, with a concentration in microwave engineering.

A TRIUMF FOR TRIQUINT

February 11, 2009
by Richard Mumford, MWJ European Editor

TriQuint Semiconductor will be showcasing the TriQuint Unified Mobile Front-end (TRIUMF) Module™ family, convergence architecture for mobile device manufacturers designing next generation 3G/4G products. The family aims to offer manufacturers a streamlined radio frequency footprint combining GSM, EDGE, WCDMA and HSPA transmit functionality into one module. This convergence of functionality into one power amplifier module should offer up to a 50 percent size reduction over today’s multi-band module solutions.

Andreas Nitschke, product marketing manager for mobile handsets at TriQuint stated, “TriQuint set the industry standard for size and performance with its highly-integrated TRITIUM and QUANTUM Module families for 3G devices. We are using this expertise and ability to design both active and passive RF elements into one elegant RF system solution in the development of the TRIUMF Module family. TRIUMF will take integration to a whole new level, combining support for multiple frequency bands and modes into a single converged solution.”

He added, “We are working closely with our chipset partners and customers to implement the architecture for next generation 3G and 4G devices with world-class RF performance in an industry leading size.”

Those interested in finding out more about the TRUIMF and TriQuint’s large portfolio of products can visit Hall 1, Stand A62 and look out for the 3GSM Mobile World Congress Wrap-up Article that will be published here after the show.

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