If you happen to see me or any other Microwave Journal staff in Montreal later this month attending IMS, make sure you say hello and ask us about EDI CON, the new conference/exhibition that the Journal and its parent company Horizon House are organizing for RF, microwave and high speed digital design in Beijing, March 2013.
EDI CON will provide an opportunity for design engineers and system integrators to learn about the latest RF/microwave and high speed digital products and technologies for today’s communication, computing, RFID, industrial wireless monitoring, navigation, aerospace and related markets. With a focus on applications, emerging technologies and practical engineering solutions, this annual event will bring together the designers at the forefront of Chinese innovation and the world’s leading multi-national technology companies.
The 2 ½ day event includes:
• Keynotes presentations from industry executives and government officials
• Networking Reception
• Peer-reviewed technical presentations
• Educational workshops
• Expert forums
• International Exhibition of RF, Microwave and High Speed Digital Component, Software and Equipment Vendors
The technical paper sessions will offer three tracks addressing High Frequency/High Speed Design; Measurement & Modeling; and System Engineering. Invited and submitted papers are reviewed by the EDI CON organizers and the technical advisory committee, which represents leading experts in the areas of EM, circuit and system simulation, test verification, RFIC, MMIC and high-speed semiconductors, passive components, and system integration.
The Workshops will provide a forum for industry practitioners to share information on specific challenging and emerging topics related to high frequency/high speed electronic design. Workshop sponsors are responsible for developing the content according to the guidelines set by the EDI CON organizers. Workshops are an interactive experience, allowing extra time for audience questions and participation, which may include demonstrations and opportunities to work with design software and/or measurement equipment.
The Panel forum sessions will feature presentations from a panel of experts followed by a joint question and answer session with audience members. Each forum session will include up to four panelists, recognized for their expertise in their respective fields. Each panelist will give a 10 minute presentation on the challenges and potential solutions impacting a specific technology or application. The conference organizers will coordinate the panel topics and invite panelists based on their qualifications to address the panel topic.
Who will attend?
The EDI CON technical program has been developed by an industry-based technical advisory committee to appeal to engineers, designers, system integrators and managers. The emphasis on advanced R&D, education and new products/technologies offers attendees from both academia and the private sector an opportunity to develop their technical skills.
Enabling “Indigenous Innovation”
In 2006, Beijing initiated a policy to promote “indigenous innovation” in the technology sector. This policy aims to develop the technical skills of Chinese engineers to facilitate a shift from low wage manufacturing to higher wage design opportunities. Recognizing the role multi-national companies will play in this effort, the policy has recently been modified to further open China’s domestic markets to foreign firms. The educational nature of EDI CON promotes innovation by enabling the exchange of ideas and better understanding of new products to enhance technical skills and promote commerce.
Beijing is home to the government ministries responsible for the policies impacting the telecommunication and aerospace industries; from spectrum allocation to directing state-sponsored R&D and prioritizing investments in technology. As a result, Beijing is also home to many of China’s leading technology institutes, private companies and the headquarters for a number of multi-national corporations’ in-country operations.
RF, Microwave & High-Speed Digital Design Track
LNAs · RF/microwave Filters & Diplexers · Power Amplifiers · Design optimization · Linearization and pre-distortion techniques · RF Power Management · Antennas · Combining/dividing structures · Oscillators and resonators · Mixers, Switches and Frequency multipliers/dividers · Designing for low jitter · Chip/Package/Board co-design · Interconnect design for SI & PI.
Measurement & Modeling Track
Active device modeling · Nonlinear measurements · Passive Device modeling · EM simulations/optimization · RF measurement techniques for high speed design · Working with S-parameters in the time domain · Behavioral models · Load pull techniques · Material Characterization · Package modeling · Advanced materials (meta, nano, etc.) · Advanced RF/mW semiconductors (GaN, GaAs, LDMOS, etc.) · Understanding and modeling Phase Noise · Thermal modeling/multi-physics analysis
Systems Engineering Track
Lower Power RF · ZigBee · NFC · Ad hoc wireless networks · BuNGee · Understanding TD-LTE · 802.11 ac/ad · MIMO OTA Testing · EMI/EMC · RFID · Remote sensing · SATCOM · M2M · Mobile Backhaul · Millimeter wave Systems · RADAR systems · Software Defined Radio · Automatic Test Systems
Call for Papers
Authors are invited to submit technical paper proposals describing original work in RF, microwave and high-speed digital electronic component or system-level design. EDI CON technical papers will be accepted in various formats including traditional paper and PowerPoint presentations. Regardless of format, submissions must high quality and robust, aimed at advancing the knowledge of attendees. Authors must submit a summary of the proposed presentation electronically by e-mail to email@example.com August 1, 2012.
The EDI CON Technical Advisory Committee will review all submissions based on quality, relevance, impact, and originality. Prospective authors are welcome to reference products in a design case study or as a proof of concept for a design methodology, as long as product references add to the educational value and are presented in an appropriately non-commercial fashion.
For more information go to: www.ediconchina.com/CallforPapers.asp
Attending the Conference
The exhibition is free to all attendees upon registration online or at the event. Conference and workshop attendees may register online after July 15th, 2012. Go to www.EDICONCHINA.com for details.