Test and Measurement Products

R&S takes wireless device precompliance testing into the lab

Rohde & Schwarz has added three new options for its compact R&S DST200 RF diagnostic chamber: the R&S DST-B160 automated 3D positioner, the R&S DST-B210 cross-polarized test antenna and the R&S DST-B270 communications antenna. The new options significantly speed up precompliance testing of wireless devices, allowing automated test sequences to be performed on the lab bench so that developers no longer require constant access to large RF test chambers.  


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UltraSource Inc. releases new thin film microcircuit CopperVia

UltraSource Inc., a supplier of custom thin film circuits and ceramic interconnect devices, announced the new CopperVia™, based on the existing patented UltraVia™ process. The CopperVia will be introduced at 2012 IEEE MTT-S IMS, June 19 - 22nd  at booth 2802. UltraSource’s new CopperVia process fills vias with pure copper material to provide a low cost, highly conductive, extremely reliable electrical and thermal path in ceramic thin film substrates. Like its sister technology, UltraVia, the CopperVia virtually eliminates epoxy or solder bleed-through while maximizing thermal and electrical conductivity and reliability.


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Agilent's Bluetooth RF test solution speeds development of devices based on TI ICs

Agilent Technologies Inc. announced its Bluetooth low-energy test solution on the N4010A wireless connectivity test set was verified by Texas Instruments Inc. for use with TI’s integrated circuits in Bluetooth Smart and Smart-Ready devices. The Bluetooth low-energy Tx/Rx test capability on N4010A gives manufacturers and design houses reliable and efficient test solutions for single-mode and dual-mode devices.


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