IoT/M2M/V2V Channel

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Nanotron Technologies GmbH announced the completion of a three-and-a-half-year collaborative project, led by the Schaeffler Technologies AG & Co. KG, a global automotive and industrial supplier, to develop compact, intelligent, autonomous sensors, also known as "smart Items," of any shape or form factor.

GLOBALFOUNDRIES (GF) and Dolphin Integration announced a collaboration to develop a series of adaptive body bias (ABB) solutions to improve the energy efficiency and reliability of system on a chip (SoC) on GF’s 22nm FD-SOI (22FDX^®) process technology for a wide range of high-growth applications such as 5G, IoT and automotive.

Qualcomm Technologies Inc., a subsidiary of Qualcomm Inc., announced that it will demonstrate advanced 5G New Radio (NR) technologies at Mobile World Congress Barcelona 2019 to showcase its roadmap and the broad range 5G technology innovations and solutions being applied across new applications and use cases.

CEVA Inc. and Autotalks announced that the companies collaborated to add C-V2X Rel. 14/15 support to the CEVA-XC DSP based Autotalks chipset, making it the world’s first and only available solution capable of supporting both DSRC and C-V2X direct communications.

SatixFy UK Ltd. introduced the world’s first Ku-Band, 256 element, electronically steered multi-beam array (ESMA) antenna at this week’s SmallSat Symposium 2019 in Mountain View, California.

Silicon Labs releases new Bluetooth^® software for the Wireless Gecko portfolio, the industry’s most comprehensive connectivity solution for the IoT.

Skyworks Solutions Inc. announced that its wireless engines are delivering connectivity in Sonos’ new versatile digital amplifier, the Amp.