NXP Semiconductors N.V. extended its leadership in smart kitchen appliance integrated circuits (IC) by making available the world’s first reference design for automated frozen food defrosting and thawing.
CETECOM has examined the implementation of the eCall test PSAP in the Rohde & Schwarz solution for the pan-European emergency call system and certified it as compliant with the CEN EN 16454:2015 standard.
Micro Harmonics announced the availability of E- and W-Band isolators with low insertion loss and superior isolation. Using a diamond substrate to channel heat to the waveguide block, power handling exceeds the current state-of-the-art.
Toshiba Electronics Europe has introduced the mixed-signal TC35679IFTG IC that is compliant with Bluetooth® Low Energy core specification 4.2 for use in harsh automotive environments and extended temperature ranges.