Test and Measurement Channel

De-mystifying Single Carrier FDMA: The New LTE Uplink

This article focuses on the physical layer (“Layer 1”) characteristics of the LTE uplink, describing the new Single-carrier Frequency Division Multiple Access (SC-FDMA) transmission scheme and some of the measurements associated with it. Understanding the details of this new transmission scheme and measurements is a vital step towards developing LTE UE designs and getting them to market.
Read More

Agilent, Aeroflex Microelectronic Solutions Partner

Agilent Technologies Inc. and Aeroflex Microelectronic Solutions announced a strategic alliance to deliver industry-leading RF and microwave components and Multi-Chip Module solutions for aerospace, satellite and military applications using Agilent’s monolithic microwave integrated circuits (MMIC). “Agilent is fully committed to helping today’s engineers create the best products for the...
Read More

Agilent Technologies Introduces End-to-End DigRF V4 Measurement Solution for Mobile Handset Design

New Test Solution Spans Digital and RF Domains to Accelerate Development of LTE and WiMAX(tm) Wireless Devices

Agilent Technologies Introduces End-to-End DigRF V4 Measurement Solution for Mobile Handset Design

Agilent Technologies Inc. has introduced the industry's first Digital Radio Frequency (DigRF) V4 test solution.

By Agilent Technologies Inc., Santa Clara, CA

Click here to find out more >>

Read More

News Wrap Up - Week of Sept 29

Summary of the RF/Microwave news items for the week of Sept 29

News Wrap Up for the Week of Sept 29News wrap up

The news items for the week of Sept 29 were dominated by test and measurement as WiMAX World took place in Chicago. The show was busy but did not seem to have as much activity as last year as the WiMAX buzz has diminished a little with some struggling implementations and LTE coming on strong. Will the WiMAX buzz heat up again with some successful upcoming implementations or will LTE steal most of the headlines?


Read More

Tektronix Provides Published Test Procedure

Tektronix Inc. , a provider of test, measurement and monitoring instrumentation, announced availability of the first published test procedures for physical layer testing of the Serial ATA Revision 3.0 standard. Tektronix provides a comprehensive high speed serial data test suite for the SATA physical layer design and debug. Complete...
Read More
See More Videos