Industry News

RFMD Launches Multi-Market Products Group

RF Micro Devices Inc. (RFMD) announced the establishment of the Multi-Market Products Group (MPG), following RFMD's successful completion of the acquisition of Sirenza Microdevices Inc. MPG will be led by Bob Van Buskirk, former president and CEO of Sirenza. MPG joins the Cellular Handset Products Group (CPG), led by...
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STMicroelectronics Lays Foundations in China

The first stone has been laid at the site of STMicroelectronics’ future chip packaging and test facility in Longgang, Guangdong Province, China, in the presence of senior officials of the Shenzhen Municipal government and other dignitaries. The site will consist of up to 40,000 m 2 of manufacturing space,...
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S.E.T. and CEA Leti Form New Bond

The partnership between S.E.T. (formerly the SUSS MicroTec Device Bonder Division) and CEA Leti has resulted in a radically new generation of high accuracy (0.5 μm), high force (4,000 N) device bonder for wafer diameters up to 300 mm. The bonder includes a built-in chamber for collective reflow in...
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Infineon Ships One Billionth RF Transceiver

Infineon Technologies , a supplier of communication ICs, has shipped its one billionth RF transceiver. For more than 15 years the company has supplied its communication ICs to all major companies in the mobile phone segment, including Nokia, Samsung, Motorola, Sony Ericsson and LG. It shipped more than 230...
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RFMD Completes Acquisition of Sirenza Microdevices

RF Micro Devices (RFMD), a global leader in the design and manufacture of high performance radio frequency systems and solutions, announced the completion of its acquisition of Sirenza Microdevices Inc. , a supplier of radio frequency components. Under the terms of the definitive merger agreement, each outstanding share of...
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