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Taconic introduces HyRelex, a family of low loss, high reliability, thin, flexible interconnect materials. HyRelex laminates can be used in conjunction with HyRelex bond-ply and cover-lay for a wide range of applications including high frequency circuits and controlled impedance low loss cables. HyRelex is robust enough to retain its...

Mician GmbH , Bremen, Germany, introduces Version 6.0 of the company's EM-software tool μWave Wizard™. The new release provides the seamless integration of 3D FEM simulation technology into the existing mode-matching and 2D FEM framework. This includes optimization, full 3D visualization of the electromagnetic fields, calculation of material and...

Atmel® Corp. , a global leader in the development and fabrication of advanced semiconductor solutions, and u-blox AG , a provider of innovative GPS receiver technology, announced today the availability of their latest weak-signal tracking GPS technology in an ultra-small form factor. The new single-chip ATR0635 measures just 7...

Pascall , booth 534, has chosen MTT-S to announce a new range of high performance OCXOs. These will be manufactured at the company's Isle of Wight facility in the south of England, UK. The oscillators will be housed in an SMA connectorised package as standard, with dimensions of 2"...

Illustrating the global reach of the IMS, the InteractGlobal Inc. press conference brought together editors from across the globe, including a large contingent from China. Following the event, where they were introduced to what IMS 2006 has to offer, received a flavor of IMS 2007 in Honolulu and heard...

Microsemi Corp. , a manufacturer of high performance analog and mixed-signal integrated circuits and high reliability semiconductors, is featuring a next-generation wideband Gap silicon carbide technology demonstration at the 2006 IEEE MTT-S in San Francisco, CA. Foresees radar, broadband communications, avionics applications Higher power/voltage operation Higher power density The...

Applied Wave Research Inc. (AWR®), a provider of high frequency electronic design automation (EDA) tools, announced that AWR and Computer Simulation Technology (CST), Darmstadt, Germany, are cooperating to integrate CST MICROWAVE STUDIO® 2006, the three-dimensional (3D) electromagnetic (EM) technology, with AWR's Microwave Office® circuit design software suite. The cooperation...

Fairchild Semiconductor is displaying its innovative solutions for RF wireless applications in booth 1041 at the IMS conference. Fairchild's comprehensive WLAN power amplifier solutions cover the entire spectrum of WLAN bands 802.11 a/b/g/n, while offering strong performance advantages such as high linearity, low current consumption, high levels of integration...

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Ansoft will be participating in the following technical presentations and workshops at the IEEE MTT-S International Microwave Symposium: Electromagnetic Simulation of Passive Components for RF Module DesignUsing Ansoft Simulation Tools Integrated to Layout Simulation and Modeling Strategies in a Silicon World Domain Decomposition and Distributed Analysis for Large MicrowaveStructures...