Industry News

Nokia and TUT Seek Open Innovation

Nokia Research Centre (NRC) and Tampere University of Technology (TUT) are creating a new framework to tighten open and innovative collaboration in their research activities. Through this initiative TUT will become the first and ­central collaboration partner in the planned Nokia Innovation Centre Tampere, Finland. Due to open in...
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Russian/US MoU Sets New Standards

The Russian national standards body, the Russian Federal Agency on Technical Regulating and Metrology, has signed a historic Memorandum of Understanding (MoU) with ASTM International, originally known as the American Society for Testing and Materials. The goals of the MoU are to remove technical barriers in economic and trade...
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Alliance Agrees on Semiconductor Development

In a move that signals a firm and ongoing commitment to future technology leadership, IBM and its joint development alliance partners, Infineon Technologies AG and Freescale Semiconductor along with its Common Platform™ technology partners, Chartered Semiconductor Manufacturing and Samsung Electronics, have signed a series of semiconductor process development and...
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NTT DoCoMo Funds Chinese Venture

NTT DoCoMo will invest $10 M with Gobi Fund II, L.P., a venture capital fund operated by Gobi Partners Inc. The Fund will target cutting-edge venture companies in China working on the convergence of telecommunications, media and technology within the IT and digital media sectors. Through its involvement with...
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