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World Wide Wi-Fi Technological Trends and Business Strategies Teik-Kheong (TK) Tan and Benny Bing Wiley-Interscience 217 pages; $62.95 ISBN: 0-471-46356-6 IEEE 802.11 wireless local area networks (LAN) are becoming ubiquitous and increasingly relied upon. The demand for wireless access to a LAN is fueled by the growth of mobile...

Two new Speedboard® prepregs have been introduced that are specifically designed to offer superior performance in applications involving cavity designs in multilayer printed circuit boards. These materials exhibit very low loss and low dielectric constant (Dk) to be compatible with high performance RF and microwave laminates. Many of today’s...

The use of polytetraflouroethylene (PTFE) as a dielectric substrate represents a mature technology in the field of RF/microwave circuit design. The growth in cellular communication infrastructure during the latter part of the twentieth century placed demands on laminated substrate manufacturers to develop both the capacity and products to make...

The introduction of RT/duroid®6002 high frequency circuit material, manufactured by Rogers Corp. in the late 1980s, changed entirely what RF/microwave engineers could select for circuit board materials. Up until that time, designers seeking options of high frequency materials could select laminates with low or high dielectric constant, based on...

Electromagnetic bandgap (EBG) materials are periodic structures that exhibit wide bandpass and band rejection properties at microwave frequencies. Introducing periodic perturbations such as dielectric rods, holes and patterns in waveguides and PCB substrates forms photonic bandgap (PBG) materials. As in a photonic crystal (PC), photon propagation is impeded by...

In the design of high frequency power amplifiers, the goal is to achieve the power gain and output power at the desired frequency in order to achieve high PAE. Large-signal S-parameters of power devices are normally not provided by the manufacturer. One of the methods to characterize the device...

Modern mobile communication systems use band-limited linear modulation schemes, such as multi-level quadrature amplitude modulation (QAM) and quadrature phase shift keying (QPSK), which have high peak-to-average power ratio characteristics. For these systems, linear power amplifiers are needed to prevent adjacent channel interference. A power amplifier operated sufficiently below the...

Bonding Films The CuClad 6250 and 6700 are low melting point bonding films that have been developed for lamination of stripline or other multilayer circuits fabricated from CuClad or other company PTFE-based laminates. Dielectric constants of 6250 and 6700 bonding films fall in the midrange of CuClad® and DiClad®...

Industry News Tore N. Anderson Tore N. Anderson died suddenly on April 14, 2004. He was 83 years old. He was one of the pioneers of the microwave industry and was widely recognized for his work in waveguide structures and antennas. He held a number of patents in the...

Waveguide, Coaxial and Dual Switches This product catalog features the company’s waveguide, coaxial and dual switches. The catalog details several microwave switches and provides an outline drawing, electrical specifications, mechanical specifications and environmental specifications of each. The catalog highlights the most common devices. Other configurations are available upon request....