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The UWB Forum announced that following a successful launch in late February 2004, it has signed up 30 members and is in talks with several major corporate supporters to join the growing coalition. The group’s rapid growth has been fueled by interest in an ultra-wideband (UWB) solution that is...

The first IEC/IEEE International Standard, which relates to instrument buses, has been published under a joint cooperation agreement. The publication of this standard under the joint agreement indicates how industry worldwide can benefit from a rational approach to international standardization that makes optimum use of existing, market-relevant technical standards....

The IEEE has approved the start of work on four projects concerning IEEE 802.15™ wireless personal area network (WPAN) standards. These projects involve a wireless mesh topology standard for WPAN devices and alterations to the high rate WPAN standard so it supports new wireless multimedia uses more effectively. Two...

World Wide Wi-Fi Technological Trends and Business Strategies Teik-Kheong (TK) Tan and Benny Bing Wiley-Interscience 217 pages; $62.95 ISBN: 0-471-46356-6 IEEE 802.11 wireless local area networks (LAN) are becoming ubiquitous and increasingly relied upon. The demand for wireless access to a LAN is fueled by the growth of mobile...

Two new Speedboard® prepregs have been introduced that are specifically designed to offer superior performance in applications involving cavity designs in multilayer printed circuit boards. These materials exhibit very low loss and low dielectric constant (Dk) to be compatible with high performance RF and microwave laminates. Many of today’s...

The use of polytetraflouroethylene (PTFE) as a dielectric substrate represents a mature technology in the field of RF/microwave circuit design. The growth in cellular communication infrastructure during the latter part of the twentieth century placed demands on laminated substrate manufacturers to develop both the capacity and products to make...

The introduction of RT/duroid®6002 high frequency circuit material, manufactured by Rogers Corp. in the late 1980s, changed entirely what RF/microwave engineers could select for circuit board materials. Up until that time, designers seeking options of high frequency materials could select laminates with low or high dielectric constant, based on...

Electromagnetic bandgap (EBG) materials are periodic structures that exhibit wide bandpass and band rejection properties at microwave frequencies. Introducing periodic perturbations such as dielectric rods, holes and patterns in waveguides and PCB substrates forms photonic bandgap (PBG) materials. As in a photonic crystal (PC), photon propagation is impeded by...

In the design of high frequency power amplifiers, the goal is to achieve the power gain and output power at the desired frequency in order to achieve high PAE. Large-signal S-parameters of power devices are normally not provided by the manufacturer. One of the methods to characterize the device...

Modern mobile communication systems use band-limited linear modulation schemes, such as multi-level quadrature amplitude modulation (QAM) and quadrature phase shift keying (QPSK), which have high peak-to-average power ratio characteristics. For these systems, linear power amplifiers are needed to prevent adjacent channel interference. A power amplifier operated sufficiently below the...