Industry News

Hittite Announces Low Loss Double-balanced Mixer Module

Hittite Microwave Corp. , a supplier of complete MMIC-based solutions for communication and military markets, announced the release of a wideband passive double-balanced mixer for use in point-to-point & point-to-multipoint radio, test equipment, laboratory and military applications from 11 to 20 GHz. The HMC-C051 is a passive double-balanced mixer...
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Powerwave Introduces GSM-UMTS Same Band Combiners

Powerwave Technologies Inc. , a global source for end-to-end wireless solutions, introduced the latest offering in its growing line-up of coverage and capacity solutions for indoor and outdoor environments--a Same Band Combiner that offers both cost savings and time to market efficiencies for wireless operators. Designed to support 850...
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GaAs Semiconductor Market Grows 17 Percent Year-on-Year

A new report from Strategy Analytics, “GaAs Semiconductor Market Grows to Over $3.6 B in 2007,” concludes that total GaAs device market exhibited year-on-year growth of 17% in 2007, beating the lackluster growth observed in the mainstream semiconductor market, and in-line with previous Strategy Analytics expectations. Overall the market...
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Mimix Broadband Receives $10 M from GaAs Labs

Mimix Broadband Inc. , a fabless semiconductor company, announced that it has secured $10 M of additional investment in its fourth round of institutional financing. The investment from GaAs Labs and participation in the round by existing investors will allow Mimix to pay off debt and provide working capital...
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Peregrine and MagnaChip Begin Final Qualification

Peregrine Semiconductor Corp. , a supplier of high-performance RF CMOS and mixed-signal communications ICs, and MagnaChip Semiconductor Ltd., an Asian-based designer and manufacturer of analog and mixed-signal semiconductor products for high volume consumer applications, announced that the final qualification phase has begun in the process technology transfer of Peregrine’s...
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Agilent Announces HiSIM2.4 Model Extraction Package

Agilent Technologies Inc. announced the release of the first commercially available HiSIM2.4 Model Extraction Package for DC and RF parameters for advanced complementary metal oxide semiconductor (CMOS) device models. The package, for use with Agilent’s Integrated Circuit Characterization and Analysis Program (IC-CAP) software platform, provides an easy-to-use, efficient and...
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