The IMS2020 and Microwave Week, scheduled for 21-26 June 2020 in Los Angeles, CA, USA, is transitioning to a virtual event. The 2020 organizers have made this difficult decision after careful consultation and review with government authorities, partners, and venues. The timeframe for the virtual event will be August 2020.
Despite the disruption from the coronavirus pandemic circling the globe, Apple managed to release the new iPhone SE, iPad Pro, Magic Keyboard and MacBook Air and maintain essentially flat revenue during its second fiscal quarter, compared to the prior year’s quarter.
Artech House announced the publication of Microwave and Millimeter-Wave Vacuum Electron Devices: Inductive Output Tubes, Klystrons, Traveling-Wave Tubes, Magnetrons, Crossed-Field Amplifiers, and Gyrotrons by A.S. Gilmour, Jr..
According to Sachin Garg, Associate Vice President, Semiconductor and Electronics at MarketsandMarkets, “mmWave is likely to play a key role to support the burgeoning mobile data traffic growth. High data transfer rate offered by this spectrum, the growing involvement of various telecom service providers, and favorable federal mandates are driving the market growth for this frequency band.”
RFMW announced design and sales support for a broadband gain block with differential input. The Qorvo QPA9143 gain block offers a 100 Ω differential-input to 50 Ω single-ended output allowing direct interface with transceiver DACs, thereby eliminating the need for a discrete balun.
Achieving a 99.85 percent quality and 98 percent delivery rating during 2019, RFMW has been recognized by BAE Systems with the 2019 Silver Tier Award for exceptional performance and contributions to supply chain success.
ZTE Corporation announced that in partnership with China Unicom, ZTE has implemented the industry’s first Tri-RAT dynamic spectrum sharing solution, SuperDSS, in the live network of the Henan Branch of China Unicom.
Samsung Foundry certified Ansys® RaptorH™ electromagnetic (EM) simulation solution for developing advanced systems-on-chip (SoC) and two and a half dimensional/three-dimensional integrated circuits (2.5D/3D-IC).