Industry News


Leading Wireless Chipset Providers Launch OpenRF to Advance RF Front End Development and Drive Interoperability

OpenRF delivers optimum system performance, greater choice in RF front end platforms, faster time-to-market, and lower Total Cost of Ownership for 5G device manufacturers

The Open RF Association (OpenRF™) today announced its formation as an industry consortium dedicated to expanding the functional interoperability of hardware and software across multi-mode RF front end and chipset platforms into the 5G era, responding to customer demand for open architectures. Its founding members include Broadcom Inc., Intel Corporation, MediaTek Inc., Murata Manufacturing Co., Ltd., Qorvo, and Samsung.

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New Features for RF Engineers in Comsol 5.6

COMSOL offered a preview of the upcoming release of COMSOL Multiphysics® version 5.6 at the COMSOL Conference 2020 North America, October 7–8. It is planned to be released in fall 2020 and brings faster and more memory-efficient solvers, better CAD assembly handling, application layout templates and a range of new graphics features including clip planes, realistic material rendering, and partial transparency. See what is new for RF engineers.

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