Anritsu Company expands its 5G test portfolio with the introduction of the device under test (DUT) holder MA8179A-AK011, the first solution to support all the possible alignment options defined and permitted in 3GPP namely Alignment Options 1/2/3.
The new IEC 61000-4-3:2020 4th edition by AR RF/Microwave Instrumentation (AR) has been released and includes the following updates: multiple test signals description, EUT and cable layout info, upper frequency limitation removal and specification of characterizing the uniform field area.
Cinch Connectivity Solutions announced the introduction of the SMP and SMPM Vertical Launch, PCB Compression Connectors. The innovative solderless design allows for excellent RF performance, and these connectors are available in both common microwave transmission line formats—Microstrip and Stripline.
TE Connectivity is shaping its card edge power connector portfolio into a comprehensive one with the introduction of single-beam, high-density (HD) heightened, HD plus (HD+) 5- and 8- beam card edge power connectors.