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NXP Semiconductors and TSMC will strengthen their cooperation to include advanced R&D in CMOS process technologies as well as having a manufacturing partnership. The strengthened global R&D cooperation will be built upon the existing NXP research organization at the IMEC facilities in Leuven, Belgium, and TSMC corporate R&D in...

EPCOS now offers its customers an on-line service to help them comply with the requirements of China’s new law on hazardous substances in electronic products. China RoHS, officially the Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP), regulates products containing any of six hazardous substances:...

The University of Juarez (UACJ), Mexico, has selected SUSS MicroTec ’s advanced wafer bonding equipment for its research laboratory. UACJ is an integral member of the Paso del Norte (PDN) Regional MEMS Cluster and a key player in supporting bi-national innovation and entrepreneurial development in Mexico. The cluster consists...

On Monday (12 February) the 2007 3GSM World Congress commenced and by the time the doors close on the world’s premier mobile event on Thursday (15 February) it is expected that over 60,000 visitors will have frequented the Fira de Barcelona Conference and Exhibition Center. Socially the event got...

Agilent Technologies Inc. announced plans to expand the company's investment in its Integrated Circuit Characterization and Analysis Program (IC-CAP) device modeling software. The company will establish a new research and development modeling center in Asia to better serve the industry's leading semiconductor foundries and to respond to advancements in...

Comtech Telecommunications Corp. announced that its Maryland-based subsidiary, Comtech Mobile Datacom Corp., received orders totaling $9.5 M on its Movement Tracking System, or MTS contract, with the U.S. Army. The total includes $8.9 M of MTS program orders and $0.6 M in follow-on orders for the Army National Guard's...

Thales Technical Unit Control and Display Systems (CDS) uses electromagnetic compatibility (EMC) simulation to reduce testing costs on each new cockpit instrument. EMC is a major design challenge in cockpit instruments because they have a clear face which makes them difficult to shield. FLO/EMC electromagnetic simulation software from Flomerics...

Silicon Laboratories Inc. , a leader in high performance, analog-intensive, mixed-signal integrated circuits (IC), announced a definitive agreement with NXP , formerly Philips Semiconductor. NXP will purchase the Aero transceiver, AeroFONE™ single-chip phone and power amplifier product lines, for $285 M in cash, with additional earn-out potential of up...

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Anaren Inc. has been selected to receive a contract valued in excess of $8 M from Alcatel-Alenia Space (France) for development and production of integrated beamforming assemblies that will be deployed on the Globalstar-2 satellite payload. The contract award, expected to be finalized within 90 days, covers design services...