Akoustis Technologies, Inc. announced that it has been awarded a new, multi-year direct-to-phase 2 (DP2) contract from DARPA to further develop Akoustis’ technology through the development of a Piezo MEMS process design kit (PDK) for the company’s proprietary and patented XBAW™ process.
Tektronix, Inc. announced its second-generation IsoVu isolated oscilloscope probes, the TIVP Series, which significantly advance the capabilities of the ground-breaking probes first introduced in 2016.
Advanced Micro Devices Inc. agreed to buy Xilinx Inc. for $35 billion in stock, one of the largest chip acquisitions ever, a transaction that gives the former industry also-ran more products and a bigger research budget to challenge leader Intel Corp.
Keysight Technologies, Inc. announced that company's 5G device test solutions have been selected by State Radio Monitoring Center Testing Center (SRTC) to support both domestic and international certification of 5G mobile devices.
Times Microwave Systems introduces field installable termination system ( FITS™) a new line of its LLSB™ cables, connectors and tools for shipboard, airborne and ground-based military interconnect systems.
Movandi announced the deployment of a 5G extender indoor smart repeater built on Movandi’s innovative BeamXR mmWave technology. Movandi’s BeamXR is the industry’s first smart active repeater solution that amplifies coverage and closes the gap in 5G mmWave deployments.