Industry News

Wireless 4G Technology Beginning to Shape Up

Although an official definition of wireless 4G technology will not be released until the 2008/2009 timeframe in the form of the ITU’s IMT-Advanced requirements, there are already clear contenders for the designation, reports In-Stat. The primary 4G technologies of the future are expected to be Long Term Evolution (LTE),...
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Around the Circuit

Industry News RF Micro Devices Inc. (RFMD), a leader in the design and manufacture of high performance radio systems and solutions for applications that drive mobile communications, and Sirenza Microdevices , a supplier of radio frequency (RF) components, announced they have signed a definitive merger agreement. Under the terms...
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Novel Design of a Printed Monopole Antenna for WLAN/WiMAX Applications

In this article, a novel design of a printed coplanar waveguide (CPW)-fed monopole antenna is implemented to simultaneously satisfy wireless local area network (WLAN) and worldwide interoperability for microwave access (WiMAX) applications. First, a pr...
In recent years, wireless communications have progressed very rapidly and wideband and multi-band antenna designs have become very important for wireless applications. Several promising wideband antennas are suitable for applications in wireless local area network (WLAN) systems and worldwide interoperability for microwave access (WiMAX). Some monopole antennas for WLAN...
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A Software Suite to Aid Workflow

All companies need to see increasing income year on year to please investors and to fund their growth. A mounting need for microwave design, combined with skilled worker shortages, make seamless growth challenging. As a result, engineers in rapidly growing companies are faced with increased workloads, more diverse work...
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Improvements to Desktop Circuit Board Prototyping

Desktop milling machines for prototyping circuit boards have long been particularly helpful to microwave engineering development teams. Often a circuit or a critical part (filter, amplifier, coupler, etc.) needs to be designed quickly to keep the entire project on schedule. In many cases the desktop milling system can create...
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High Density RF Interconnect

With system space ever at a premium and operating frequencies constantly on the rise today’s RF/microwave interconnection cables must follow suit and be smaller and higher performance. One of the limiting factors to this progression has always been the cable connector. Its pin/socket-type male and female interconnect system adds...
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An Improved Thermal Design for
III-N HEMTs on Silicon Substrates

Thermal design is a primary concern for enabling electronic devices to reach their potential to operate at high power densities. Heat must be removed efficiently in order to keep the channel temperature below a desired limit. Elevated operating tempera...
The power density of large periphery III-N HEMTs can be as high as 5 W/mm, 1–3 much greater than GaAs (1 W/mm) and Si LDMOS (0.8 W/mm). These devices can generate more power per unit area of chip, or equivalent power in a much smaller package. All power that...
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