Industry News

A Versatile Multilevel Amplifier for PCS Applications

A multilevel amplifier platform with separate mechanical sections that incorporate an RF pallet, a DC distribution pallet and a microcontroller I/O pallet
PRODUCT FEATURES A Versatile Multilevel Amplifier for PCS Applications AML Communications Inc. Camarillo, CA C ommunication amplifier designers today are challenged with rapidly bringing to market a qualified product in a mature form factor, while meeting strict spectral regrowth requirements. Combine this with varying power level and gain requirements...
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A Low Loss LTCC System for Wireless Applications

A vector modulator with the ability to convert any of today's analog signal generators to a digital signal format at a fraction of the cost of a new digital generator
PRODUCT FEATURES A Vector Modulator to Convert Analog Signal Generators to Digital Formats IFR Systems Inc. Wichita, KS T here is much capital money invested in analog signal generators within today's research and development laboratories and manufacturing floors. Yet the trend in wireless technology is to use complex digital...
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The Next Level of Design Automation

This month's cover features Microwave Office 2000 version 4.0 electronic design automation software
COVER FEATURE The Next Level of Design Automation Applied Wave Research Inc. (AWR) El Segundo, CA M icrowave Office 2000 Version 4.0 begins shipping in December of this year. The latest release of the popular electronic design automation (EDA) suite includes revolutionary new capabilities for automating the high frequency...
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A VSWR Meter Using a Power Sensing Termination

A Smartload-based VSWR mater that offers linear power detection over a wide range of power levels and temperatures
PRODUCT FEATURES A VSWR Meter Using a Power Sensing Termination EMC Technology Inc. Cherry Hill, NJ T ransmitted power detection is important in wireless basestation applications in order to insure proper geographical coverage and to meet radiated power regulations. If the power detection is done between the transmitter and...
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A Low Loss LTCC System for Wireless Applications

A low temperature co-fired ceramic material system to address new market demands such as wireless telephones, automotive components and Bluetooth modules
PRODUCT FEATURES A Low Loss LTCC System for Wireless Applications Heraeus Inc. W. Conshohocken, PA A new low temperature co-fired ceramic (LTCC) material system has been developed to address emerging new communications market demands such as wireless telephones, automotive components and Bluetooth modules. Unlike other materials for microwave applications,...
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A Voltage Variable Attenuator Using Silicon PIN Diodes and a Passive GaAs MMIC in a Plastic SMT Package

A voltage variable attenuator (VVA) for the commercial wireless market with linear operating power and intercept points higher than GaAs FET-based VVAs
PRODUCT FEATURES A Voltage Variable Attenuator Using Silicon PIN Diodes and a Passive GaAs MMIC in a Plastic SMT Package RF& MW Components Group, M/A-COM Inc. Lowell, MA A unique voltage variable attenuator (VVA) has been developed for the commercial wireless market. The device has linear operating power and...
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A Simple Gain Equalizer for a PCS-band Amplifier

A simple distributed network, which has the effect of flattening the frequency response of an amplifier or system by reducing its gain in a particular frequency range
TECHNICAL NOTES A Simple Gain Equalizer for a PCS-band Amplifier Barney Arntz Philips Semiconductors Mansfield, MA A simple distributed network is described, which has the effect of flattening the frequency response of an amplifier or system by reducing its gain in a particular frequency range. Operating with a quarter-wave...
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Improving Accuracy and Reliability of Microwave On-wafer Silicon Device Measurements

Recent research findings and general guidelines that relate to microwave on-wafer measurement of devices fabricated using silicon technologies
TECHNICAL FEATURES Improving Accuracy and Reliability of Microwave On-wafer Silicon Device Measurements Troels Emil Kolding Aalborg University, RISC Group Denmark Aalborg, Denmark This article summarizes recent research findings and general guidelines for microwave on-wafer measurement of devices fabricated using silicon technologies. Issues specific to low resistivity substrates and low...
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Extending Gold Thick-film Technology through Materials and Process Development

A combination of new gold powder technology and advanced manufacturing techniques that makes it possible to achieve fine-line resolutions of 3 mils (75 µm) through screen printing methods
TECHNICAL FEATURES Extending Gold Thick-film Technology through Materials and Process Development Meg Tredinnick and David Malanga Heraeus Inc., Circuit Materials Division West Conshohocken, PA New powder and screen technologies have allowed for the development of a thick-film gold paste that meets a difficult list of requirements. This new Au...
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Time Domain Analysis of a Printed Circuit Board Via

Time domain analysis of a printed circuit board via connecting two semi-infinitely-long microstrip transmission lines above a ground plane
TECHNICAL FEATURES Time Domain Analysis of a Printed Circuit Board Via Brock J. LaMeres Agilent Technologies Colorado Springs, CO T.S. Kalkur University of Colorado, Department of Electrical and Computer Engineering Colorado Springs, CO This article describes the time domain analysis of a printed circuit board via connecting two semi-infinitely-long...
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