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Thinking that they were facing a “normal” set of technical challenges, MEMS switch developers consistently underestimated the difference between being able to sample a few prototype devices from a wafer and consistently manufacturing products that deliver high levels of quality and reliability. This created market expectations that are only...
The newly released Strategy Analytics GaAs and Compound Semiconductor Technologies (GaAs) service report, "Defense Spending Increases Provide Robust Market for Compound Semiconductors," projects that the market for GaAs devices will see continued growth at a CAAGR of 8% through to 2010. GaAs remains a staple ingredient in military and...
Laird Technologies , a designer and manufacturer of antenna solutions, electromagnetic interference (EMI) shielding products, telematics, signal integrity products and thermal management solutions, announced the acquisition of AeroComm for $38 M. AeroComm is a designer and manufacturer of wireless communications systems for low- to mid-volume OEM applications where high...
NXP Semiconductors and TSMC will strengthen their cooperation to include advanced R&D in CMOS process technologies as well as having a manufacturing partnership. The strengthened global R&D cooperation will be built upon the existing NXP research organization at the IMEC facilities in Leuven, Belgium, and TSMC corporate R&D in...
EPCOS now offers its customers an on-line service to help them comply with the requirements of China’s new law on hazardous substances in electronic products. China RoHS, officially the Administration on the Control of Pollution Caused by Electronic Information Products (ACPEIP), regulates products containing any of six hazardous substances:...
The University of Juarez (UACJ), Mexico, has selected SUSS MicroTec ’s advanced wafer bonding equipment for its research laboratory. UACJ is an integral member of the Paso del Norte (PDN) Regional MEMS Cluster and a key player in supporting bi-national innovation and entrepreneurial development in Mexico. The cluster consists...
On Monday (12 February) the 2007 3GSM World Congress commenced and by the time the doors close on the world’s premier mobile event on Thursday (15 February) it is expected that over 60,000 visitors will have frequented the Fira de Barcelona Conference and Exhibition Center. Socially the event got...
Agilent Technologies Inc. announced plans to expand the company's investment in its Integrated Circuit Characterization and Analysis Program (IC-CAP) device modeling software. The company will establish a new research and development modeling center in Asia to better serve the industry's leading semiconductor foundries and to respond to advancements in...
Comtech Telecommunications Corp. announced that its Maryland-based subsidiary, Comtech Mobile Datacom Corp., received orders totaling $9.5 M on its Movement Tracking System, or MTS contract, with the U.S. Army. The total includes $8.9 M of MTS program orders and $0.6 M in follow-on orders for the Army National Guard's...
Thales Technical Unit Control and Display Systems (CDS) uses electromagnetic compatibility (EMC) simulation to reduce testing costs on each new cockpit instrument. EMC is a major design challenge in cockpit instruments because they have a clear face which makes them difficult to shield. FLO/EMC electromagnetic simulation software from Flomerics...
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